번호 제목 등록일
3 SAMSUNG computer program registered | Cure simulator ver. 2.0
Hak Sung Kim
2007.01.01
2 Korea computer program registered | Design Tool for adhesively bonded Joint
(NO. 2004-01-12-2393)
Sang Wook Park, Hak Sung Kim, Seong Su Kim, Dai Gil Lee
2004.01.12
1 Korea computer program registered | Axiomatic CLPT
(NO. 2004-01-12-2392)
Hak Sung Kim, Dai Gil Lee
2004.01.12
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