MCDM LAB

Multifunctional Composite Design and Manufacturing Laboratory
번호 제목 등록번호 상태 등록일
19

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME, AND ELECTRONIC DEVICE USING THE SEMICONDUCTOR PACKAGE

US Patent Registered

Hak-Sung Kim, Ho-Geon Song and Seok-Won Jeong

20090134510 Register 2009.05.28
18

Semiconductor package and method for manufacturing the same, and electronic device using the semiconductor package

Korea Patent

Hak Sung Kim, Ho Geon Song, Seok Won Jeong

10-2007-0093674 Pending 2007.09.14
17

Method of determining molding process variables and system for performing the same

Korea Patent

Hak Sung Kim

10-2007-0087642 Pending 2007.08.30
16

Method of fabricating semiconductor device package

Korea Patent

Seok Won Jeong, Hak Sung Kim, Ho Geon Song

10-2007-0078264 Pending 2007.08.03
15

A vibration actuator

Korea Patent Registered

Kang Dae Lyun, Dai Gil Lee, Sang Wook Park, Hak Sung Kim, etc

0691150 Register 2007.07.28