ACHIEVEMENT
번호 | 제목 | 권(호) | 쪽 | 출판년도 |
---|---|---|---|---|
250 |
Advanced Functional MaterialsMeasurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation testYoung-Min Ju, Dukyong Kim, Se-Min Lee, Heuisu Kim, Daewoong Lee, Yeontaek Hwang, Seung Hwan Lee and Hak-Sung Kim |
(Sumitted) | 9999.99.99 | |
249 |
Polymer TestingNon-destructive evaluation of PET thermal degradation using terahertz time domain spectroscopyTae-Wan Kim, Sang-Il Kim, Hyun-Jin Jung, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
248 |
Transactions on Pattern Analysis and Machine IntelligenceFast warpage prediction of printed circuit board with the automatically classified copper patterns for anisotropic viscoelastic homogenizationWoong-Kyoo Yoo,Jeong-Hyeon Baek,Jong-Whi Park,Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
247 |
NDT & E InternationalIn-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electro-magnetic waveHeon-Su Kim, Sang-Il Kim, Tae-Wan Kim, Jin-Sang Lim, Dong-Su Han, Hae-Gu Lee, and Hak-Sung Kim |
(Sumitted) | 9999.99.99 | |
246 |
Advanced Composites and Hybrid MaterialsA Critical Review of the Past, Present, and Future of 3D Printing for Continuous and Short Fiber CompositesSanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song, and Hak-Sung Kim |
(Submitted) | 9999.99.99 |