MCDM LAB
MCDM LAB
ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 244 |
Advanced Functional MaterialsMeasurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation testYoung-Min Ju, Dukyong Kim, Se-Min Lee, Heuisu Kim, Daewoong Lee, Yeontaek Hwang, Seung Hwan Lee and Hak-Sung Kim |
(Sumitted) | 9999.99.99 | |
| 243 |
Materials & DesignsPrediction of fatigue life of semiconductor package under thermal cycling: combined effect of package design and solder materialsHeon-Su Kim, You-Gwon Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
(Revised) | 9999.99.99 | |
| 242 |
Polymer TestingNon-destructive evaluation of PET thermal degradation using terahertz time domain spectroscopyTae-Wan Kim, Sang-Il Kim, Hyun-Jin Jung, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 241 |
ACS Applied Materials & InterfacesUltra milli-second flip-chip bonding process via intense pulsed light irradiationYoung-Min Ju, Seong-Ung Ryu, Jong-Whi Park, and Hak-Sung Kim |
(Revised) | 9999-99-99 | |
| 240 |
Composites Part BBending performance of novel curved sandwich structures featuring 3D printed continuous carbon fiber reinforced composite corrugated core with railway interlockingHui-Jin Um, Na-Hyun Jeon, Hyun-Ji Rho, Ji-Hwan Shin and Hak-Sung Kim |
(Accept) | 9999-99-99 |