ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 454 |
2025 ISMPPrediction of the warpage for large-scale semiconductor package using equivalent model considering the anisotropic thermomechanical properties based on multi-physics simulation유웅규, 송준섭, 구형모, 김학성 |
2025.11 |
| 453 |
2025 ISMPDrop impact reliability of SAC Solder: Insights from high strain-rate and elevated-temperature behavior유동훈, 김유권, 이세민, 방진영, 이정범, 김학성 |
2025.11 |
| 452 |
2025 ISMPThermal Fatigue Characterization of SAC305 Solder Joints via a DNP-Oriented Modified Test Vehicle박형빈, 김유권, 김학성 |
2025.11 |
| 451 |
2025 KISMStudy of Rellability of Redistribution Layers IN Advanced Packaging: Electrochemical Migration Analysis and Parametric Electrochemical Modelling이호진, 백정현, 김태훈, 심지혜, 김학성 |
2025.11 |
| 450 |
2025 KISMEffects of EMC Degradation on Viscoelastic Properties and Rellability in Power Semiconductor Packages박세준, 이세민, 한희주, 김학성 |
2025.11 |