ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 463 |
2025 EPTCA Modified Test Vehicle Incorporating Distance from Neutral Point (DNP) - Induced Strain Gradients for Single - Specimen Fatigue Life Assessment of Solder Joints박형빈, 김유권, 방진영, 이종범, 김학성 |
2025.12 |
| 462 |
2025 EPTCUV - Assisted Fluxless T hermal - C ompression B onding U nder A mbient C onditions: Toward Scalable and Residue - Free Interconnects for Advanced Packaging김유권, 유동훈, 박형빈, 박종휘, 신승철, 강동석, 김학성 |
2025.12 |
| 461 |
2025 ISMPPrediction of the warpage for large-scale semiconductor package using equivalent model considering the anisotropic thermomechanical properties based on multi-physics simulation유웅규, 송준섭, 구형모, 김학성 |
2025.11 |
| 460 |
2025 ISMPDrop impact reliability of SAC Solder: Insights from high strain-rate and elevated-temperature behavior유동훈, 김유권, 이세민, 방진영, 이정범, 김학성 |
2025.11 |
| 459 |
2025 ISMPThermal Fatigue Characterization of SAC305 Solder Joints via a DNP-Oriented Modified Test Vehicle박형빈, 김유권, 김학성 |
2025.11 |