About Us
In this laboratory, we perform a multi-disciplinary research on a variety of topics, such as printed electronics, semiconductor packaging, reliability studies, energy storage research body, the functinal composites
LAB NEWS
융합기계공학과 첨단 반도체패키징 혁신(APIL) 연구실 박세준 연구원 제20회 반도체 장학증서 수여식에서 ‘Applied Materials 장학생’으로 선발
2025-12-08
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- · 융합기계공학과 첨단 반도체패키징 혁신(APIL) 연구실 박세준 연구원 제20회 반도체 장학증서 수여식에서 ‘Applied Materials 장학생’으로 선발 2025-12-08
- · 융합기계공학과 첨단 반도체패키징 혁신(APIL) 연구실 김학성 교수님 한국과학기술단체총연합회 제정 과학기술우수논문상 수상 2025-07-15
- · [한양 뉴스 포털 NEWS H] 한양대 김학성·이승환 교수팀, 반도체 접착력 정밀 측정기술 개발로 신뢰성 향상 이끈다 2025-07-11
PHOTOS
Research Areas
Printed electronics
Printed electronics is electronic device or electronics made by using printing methods.
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Structural Composites
The mechanical components need to have light weight and high strength
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Nondestructive Evaluation with THz
Terahertz waves can be used for Non-Destructive Evaluation in manufacturing, quality control, and process monitoring.
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Semiconductor packaging technology
Market occupation of high density memory products such as smart phone and tablet PD is increasing rapidly.
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