About Us
In this laboratory, we perform a multi-disciplinary research on a variety of topics, such as printed electronics, semiconductor packaging, reliability studies, energy storage research body, the functinal composites
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- · 융합기계공학과 다기능성복합재료(MCDM)연구실 김헌수 석박사통합과정 한국기계기술단체총연합회 우수논문상 수상 2025-01-17
- · 융합기계공학과 다기능성복합재료(MCDM) 연구실 김학성 교수님 산학연협력 선도대학 육성사업(LINC 3.0) 공로상 수상 2024-12-30
- · 미국 소비자 기술협회(CTA) 주관 세계 최대 규모 ICT 융합 전시회 Consumer Electronics Show(CES) 참석 2024-03-05
PHOTOS
Research Areas
Printed electronics
Printed electronics is electronic device or electronics made by using printing methods.
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Structural Composites
The mechanical components need to have light weight and high strength
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Nondestructive Evaluation with THz
Terahertz waves can be used for Non-Destructive Evaluation in manufacturing, quality control, and process monitoring.
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Semiconductor packaging technology
Market occupation of high density memory products such as smart phone and tablet PD is increasing rapidly.
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