ACHIEVEMENT
| 번호 | 제목 | 등록번호 | 상태 | 등록일 |
|---|---|---|---|---|
| 20 |
전도성 은 나노잉크의 광소결 방법국내특허출원김학성 |
10-2011-0050731 | Pending | 2011.05.27 |
| 19 |
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME, AND ELECTRONIC DEVICE USING THE SEMICONDUCTOR PACKAGEUS Patent RegisteredHak-Sung Kim, Ho-Geon Song and Seok-Won Jeong |
20090134510 | Register | 2009.05.28 |
| 18 |
Semiconductor package and method for manufacturing the same, and electronic device using the semiconductor packageKorea PatentHak Sung Kim, Ho Geon Song, Seok Won Jeong |
10-2007-0093674 | Pending | 2007.09.14 |
| 17 |
Method of determining molding process variables and system for performing the sameKorea PatentHak Sung Kim |
10-2007-0087642 | Pending | 2007.08.30 |
| 16 |
Method of fabricating semiconductor device packageKorea PatentSeok Won Jeong, Hak Sung Kim, Ho Geon Song |
10-2007-0078264 | Pending | 2007.08.03 |