ACHIEVEMENT

Journal paper

Patent

Computer program

Conference

ALL

Register

Pending
번호 제목 등록번호 상태 등록일
18

Semiconductor package and method for manufacturing the same, and electronic device using the semiconductor package

Korea Patent

Hak Sung Kim, Ho Geon Song, Seok Won Jeong

 10-2007-0093674 Pending 2007.09.14
17

Method of determining molding process variables and system for performing the same

Korea Patent

Hak Sung Kim

 10-2007-0087642 Pending 2007.08.30
16

Method of fabricating semiconductor device package

Korea Patent

Seok Won Jeong, Hak Sung Kim, Ho Geon Song

 10-2007-0078264 Pending 2007.08.03
15

A vibration actuator

Korea Patent Registered

Kang Dae Lyun, Dai Gil Lee, Sang Wook Park, Hak Sung Kim, etc

 0691150 Register 2007.07.28
14

Bearing Assembly and Method for Manufacturing the Same

US Patent Registered

Dai Gil Lee,Dong Chang Park, Seong Min Lee, Byung Chul Kim, Hak Sung Kim, Sung Su Kim, Jong Woon Kim

 10-11679038 Register 2007.02.26
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