MCDM LAB

Multifunctional Composite Design and Manufacturing Laboratory

ACHIEVEMENT

Journal paper

Patent

Computer program

Conference

ALL

Register

Pending
번호 제목 등록번호 상태 등록일
5

Semiconductor package and method for manufacturing the same, and electronic device using the semiconductor package

Korea Patent

Hak Sung Kim, Ho Geon Song, Seok Won Jeong

 10-2007-0093674 Pending 2007.09.14
4

Method of determining molding process variables and system for performing the same

Korea Patent

Hak Sung Kim

 10-2007-0087642 Pending 2007.08.30
3

Method of fabricating semiconductor device package

Korea Patent

Seok Won Jeong, Hak Sung Kim, Ho Geon Song

 10-2007-0078264 Pending 2007.08.03
2

Method for attaching die with fiber reinforced polymer

Korea Patent

Hak Sung Kim, Ho Geon Song, Man-Hee Han, Hui Seok Kim

 10-2006-0075808 Pending 2006.08.10
1

Shaft coupling and method thereof

Korea Patent

Dai Gil Lee, Hak Sung Kim

 10-2003-0041108 Pending 2003.06.24
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