ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 348 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Improvement of assembly reliability by optimization of pad design on printed circuit boardDong-woon Park, Hak-Sung Kim |
2022.11 |
| 347 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Study on the mixed-mode delamination of epoxy mold compound(EMC)/printed circuit board(PCB) interface considering various temperature and moisture absorptionHui-Jin Um, Se-Min Lee, Dae-Woong Lee, Sangyul Ha, and Hak-Sung Kim |
2022.11 |
| 346 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Prediction of Solder Fatigue Life of Package by Automated Parametric Modeling Simulation TechniqueHeon-Su Kim, You-Gwon Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
2022.11 |
| 345 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Warpage simulation of bi-material strip by the effective cure shrinkage measurement of EMC using dielectric and FBG sensorsJeong-Hyeon Baek, Dong-Woon Park, Han-Sung Ryu, Gyung-Hwan Oh, and Hak-Sung Kim |
2022.11 |
| 344 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Corrosion lifetime prediction of printed circuit board under marine atmosphere condition using numerical simulation methodSang-Il Kim, Dug-Joong Kim, Do-Hyung Kim, Dong-Min Jang,Jin-Woo Jang, Seong-Yeong Lee, and Hak-Sung Kim |
2022.11 |