ABOUT US
Hui-jin Um
(Ph.D.)
Hanwha Aerospace
Design and analysis of fiber reinforced composites
Semiconductor Packaging reliability
E-mail :
gog9057@gmail.com
Undergraduate Student in Hanyang University
Internship of Multifunctional Composite Design and Manufacturing Laboratory
Department of Mechanical Engineering, HanyangUniversity
Engineering center, 311, 17 Haengdang-dong, Seoul133-791, Republic of Korea
> Education
2011~2014
Gyeongsan Girl’s High School
2014~2018
B.S. Mechanical Engineering
2018~
M.S.&Ph.D Mechanical Engineering
> Patents
1. 김학성, 유명현, 엄희진, 김헌수, 이지석, "샌드위치 구조물 및 그 제조 방법", 국내특허등록, 10-2021-0147675, 2024.03.26
2. 김학성, 엄희진, 전나현, 한영구, "다기능성 에너지 저장구조체 상에 배치된 전극 기능 제어을 위한 기계적, 전기적 체결 방법", 국내특허출원, 10-2022-0132604, 2022.10.14
3. 김학성, 엄희진, 전나현, 노현지, 유웅규, "하중 지지 장치{LOAD SUPPORTING DEVICE}", 국내특허출원, 10-2024-0082811, 2024.06.25
> International (Published 11, Submitted 1)
1. Yong-Rae Jang, Sung-Jun Joo, Ji-Hyeon Chu, Hui-Jin Um, Jong-Whi Park, Chung-Hyeon Ryu, Myeong-Hyeon Yu and Hak-Sung Kim, "A review on intense pulsed light sintering technologies for conductive electrodes in printed electronics", International Journal of Precision Engineering and Manufacturing-Green Technology, 2020, 1-37
2. Chung-Hyeon Ryu, Hui-Jin Um, and Hak-Sung Kim, "Enhancing intense pulsed light sintering characteristic of Cu nanoparticle/microparticle-ink using UV surface modification on polyimide substrate", Thin Solid Films, 2020, 701, 137951
3. Hui-Jin Um, Yeon-Taek Hwang<, Kyung-Hee Choi and Hak-Sung Kim, "Effect of crystallinity on the mechanical behavior of carbon fiber reinforced polyethylene-terephthalate (CF/PET) composites considering temperature conditions", Composites Science and Technology, 2021, 207, 108745
4. Yeon-Taek Hwang, Hui-Jin Um, Myeong-Hyeon Yu, Dae-Woong Lee, Mi-Jung Lee, Hak-Sung Kim, "Finite element analysis of moisture induced thermo-mechanical delamination of semiconductor packages considering in-situ moisture desorption during reflow process", Microelectronics Reliability, 2021, 121, 114146
5. Hui-Jin Um, Heon-Su Kim, Woolim Hong, Hak-Sung Kim, Pilwon Hur, "Design of 3D printable prosthetic foot to implement nonlinear stiffness behavior of human toe joint based on finite element analysis", Scientific reports, 2021, 11.1: 1-11.
6.Hui-Jin Um, Yeon-Taek Hwang, Il-Joon Bae, Hak-Sung Kim, "Design and manufacture of thermoplastic carbon fiber/polyethylene terephthalate composites underbody shield to protect the lithium-ion batteries for electric mobility from ground impact" Composite Part B, 2022, 238, 109892
7. Hui-Jin Um, Ji-Seok Lee, Ji-Hwan Shin, and Hak-Sung Kim, "3D printed continuous carbon fiber reinforced thermoplastic composite sandwich structures with corrugated cores for high stiffness/load capability" Composite Structures, 2022, 291, 115590
8. Woolim Hong, Namita Anil Kumar, Shawanee Patrick, Hui-Jin Um, Heon-Su Kim, Hak-Sung Kim, and Pilwon Hur, "Empirical Validation of an Auxetic Structured Foot With the Powered Transfemoral Prosthesis", IEEE ROBOTICS AND AUTOMATION LETTERS, 2022, Vol 7.4, 11228-11235
9. Hui-Jin Um, Se-Min Lee, Dae-Woong Lee, Sangyul Ha, Hak-Sung Kim, " Mixed mode fracture toughness of epoxy molding compound/printed circuit board interface of semiconductor packages with respect to temperature and moisture", Engineering Fracture Mechanics, 2023, 289, 109429
10. Hui-Jin Um, Na-Hyun Jeon, Ji-Hwan Shin and Hak-Sung Kim, "High‑performance multifunctional energy storage‑corrugated lattice core sandwich structure via continuous carbon fiber (CCF)/polyamide6 (PA6) 3D printing", Advanced Composites and Hybrid Materials, 2023, 6:182
11. Yeon-Taek Hwang, Hui-Jin Um, Hak-Sung Kim, "Multi-scale progressive failure analysis of shear deformed woven fabric composites considering its pre-forming process", Composite part A, 2023, 174:107713
12. Hui-Jin Um, Young-Min Ju, Dae-Woong Lee, Jinho Ahn, Hak-Sung Kim, "Reduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compound", Materials and Design, 2024 (Submitted)
> Conference (Presentation 8, Poster 5)
1. 엄희진, 황연택, 최경희, 김학성, "탄소섬유 강화 PET 복합재의 결정화도에 따른 온도별 기계적 특성 평가", 2019 대한기계학회 재료 및 파괴부분 춘계학술대회, April 2019(presentation)
2. Hui-Jim Um, Yeon-Taek Hwang, Kyung-Hee Choi and Hak-Sung Kim, "Influence of PET crystallinity on the mechanical behavior of CFRP composites at various temperature", 22nd International Conference on Composite Materials (ICCM22), August 2019(Poster)
3. Yeon-Taek Hwang, Hui-Jin Um, Kyung-Hee Choi and Hak-Sung Kim, "Effect of Nano-Material Spray on the Mechanical Properties of the CF/Nano-PET Composites", 22nd International Conference on Composite Materials (ICCM22), August 2019(Presentation)
4.Hui-Jin Um and Hak-Sung Kim, "Bending properties of 3D printed corrugated-core sandwich structure using CFF", KSCM Jul 2020 (Presentation)
5. Hui-Jin Um, Yeon-Taek Hwang and Hak-Sung Kim, " Effect of crystallinity on the mechanical behavior of carbon fiber reinforced polyethylene terephthalate composites", Asia-Pacific Conference on Fracture and Strength (APCFS) Nov 2020 (Presentation)
6. Hui-Jin Um, Heon-Su Kim, Woo-Lim Hong, Hak-Sung Kim, and Pil-Won Hur, "Structural behavior evaluation of prosthetic foot using the auxetic structure via finite element analysis", August 2020(Poster)
7. Hui-Jin Um, Heon-Su Kim, Woo-Lim Hong, Hak-Sung Kim, and Pil-Won Hur, "3D-Printable Toe-joint Design of Prosthetic Foot", July 2021 (Presentation)
8. Heon-Su Kim, Hui-Jin Um, Woo-lim Hong, Hak-Sung Kim, and Pilwon Hur,"Structural design for energy absorption during heel strike using the auxetic structure in the heel part of the prosthetic foot", July 2021 (Poster)
9. 엄희진, 이지석, 김학성, "3D 프린팅된 샌드위치 구조의 굽힙 특성", 한국군사과학기술학회 종합학술대회, September 2021
10. Hui-Jin Um, Se-Min Lee, Dae-Woong Lee, Sangyul Ha, and Hak-Sung Kim, "Study on the mixed mode delamination of epoxy mold compound(EMC)/printed circuit board(PCB) interface considering various temperature and moisture absorption", International symposium on Microelectronics and packaging (ISMP), November 2022 (Oral)
11. Hui-Jin Um, Dae-Woong Lee, Mi-Jung Lee and Hak-Sung Kim, "Investigation on the thermo-mechanical behavior of semiconductor package considering moisture effect through finite element analysis", International symposium on Microelectronics and packaging (ISMP), November 2022 (Poster)
12. Hui-Jin Um, Dae-Woong Lee, Sangyul Ha, and Hak-Sung Kim, "Prediction of delamination at interface of printed circuit board/epoxy molding compound under mixed-mode loading" , IEEE Electron Devices Technology and Manufacturing (IEEE EDTM), March 2023 (Poster)
13. Hui-Jin Um, Young-Min Ju, Dae-Woong Lee, Sangyul Ha, and Hak-Sung Kim, "Prediction of semiconductor package behavior according to the curing process conditions of epoxy molding compound", 한국마이크로전자 및 패키징학회(KMEPS) 정기학술대회, April 2023 (Oral)
> Awards and Honors
APCFS 2020
Bronze Price
KMEPS 2023
우수 논문 발표상
