You-Gwon Kim (Ph.D. course)
Research Interests
Semiconductor Packing Solder reliability
Hybrid bonding
Fluxless bonding
Deep neural network
E-mail yougwon1@gmail.com
Gyu-Won Kim (Ph.D. course)
Research Interests
Composite Materials
Semiconductor Packaging
Deep neural network
E-mail kyuwon817@gmail.com
Tae-Wan Kim (Ph.D. course)
Research Interests
Semiconductor Packing Solder reliability,
Non-destructive evaluation (NDE) using THz wave,
Semiconductor packaging inspection
E-mail kty98031314@gmail.com
Woong-Kyoo Yoo (Ph.D. course)
Research Interests
Semiconductor Packaging
Pattern analysis
E-mail ywk1105@gmail.com
Young-Woo Kim (M.S. course)
Research Interests
E-mail kimyoungwoo8189@gmail.com
Jae-Sung Kim (Ph.D. course)
Research Interests
E-mail jaesungk77@gmail.com
Hyeong-Bin Park (M.S./Ph.D. course)
Research Interests
Semiconductor Packaging Solder reliability
Hybrid bonding reliability
Fluxless bonding
E-mail zbxb990821@gmail.com
Jun-Seop Song (M.S./Ph.D. course)
Research Interests
Composite Materials
Semiconductor Packaging
E-mail seop7147@gmail.com
Kang Hee Kim (Administrative Assistant)
Research Interests
E-mail egao95@hanyang.ac.kr
Suk Hyung Song (Packaging Fab Manager)
Research Interests
E-mail tjgud0404@hanyang.ac.kr
Dong-Hoon Yoo (M.S./Ph.D. course)
Research Interests
Semiconductor Packaging Solder reliability
Split Hopkinson pressure bar
Hybrid bonding reliability
E-mail ydonghoon98@gmail.com
Ho-Jin Lee (M.S./Ph.D. course)
Research Interests
Semiconductor packaging reliability (RDL, interconnection)
Corrosion analysis and reliability
E-mail lhj0699@gmail.com
Se-Jun Park (M.S. course)
Research Interests
Semiconductor Packaging
Deep learning algorithm
Corrosion analysis and reliability
E-mail ddl07113s@gmail.com
Min-Woo Jeon (M.S./Ph.D. course)
Research Interests
Non-destructive evaluation (NDE) using THz wave
Semiconductor packaging inspection
E-mail minwoo5963@gmail.com
Sanjay Kumar (Post doctoral)
Research Interests
Composite
E-mail sanjaykumarbind93@gmail.com
Yun-Joong Kim (M.S. course)
Research Interests
Semiconductor Packaging (Glass Interposer, RDL, Signal Integrity)
Semiconductor Device Fabrication
IPL bump
E-mail yunjoongkim1216@gmail.com
Hee-Ju Han (M.S. course)
Research Interests
Semiconductor Packaging
Signal integrity
E-mail hhju1024@gmail.com
Woo-Jin An (M.S./Ph.D. course)
Research Interests
E-mail ahnwoojinsk37@gmail.com
Chae-Young Ahn (M.S. course)
Research Interests
Semiconductor Packaging
Composite Materials
E-mail avery.ahn57@gmail.com
Hae-Su Ahn (M.S./Ph.D. course)
Research Interests
E-mail haesoo0907@gmail.com
Jae-Min Youm (M.S. course)
Research Interests
E-mail jaeminyoum@gmail.com
Sun-Geun Ko (M.S. course)
Research Interests
E-mail dimkk@naver.com
Seung-Won Lee (M.S. course)
Research Interests
Semiconductor Packaging Solder reliability
Hybrid bonding reliability
E-mail twins7166@gmail.com
Jei Jang (M.S./Ph.D. course)
Research Interests
E-mail zzeiijang@gmail.com
Na-Young Kim (M.S. course)
Research Interests
Semiconductor Package
Reliability test
E-mail nayoung9894@gmail.com
Ga-Eun Lee (Ph.D. course)
Research Interests
Semiconductor Packaging Process Development & Reliability
E-mail gaaeuni@gmail.com
Hye-Eun Lee (M.S. course)
Research Interests
Semiconductor Packaging Reliability Analysis
E-mail 2hyeeun96@gmail.com
Seung-Yeop Shin (Internship)
Research Interests
Composite materials
E-mail sunbi1023@hanyang.ac.kr
Seong-Jae Maeng (Internship)
Research Interests
Non-destructive evaluation (NDE) using THz wave Semiconductor packaging inspection
E-mail tjdwo3655@hanyang.ac.kr
Jae-Jun Kim (Internship)
Research Interests
Semiconductor Packaging Solder reliability
Hybrid bonding
E-mail jaejun0905@hanyang.ac.kr
Hyun-Seok Kim (Internship)
Research Interests
Non-destructive evaluation (NDE) using THz wave Semiconductor packaging inspection
E-mail apo920@hanyang.ac.kr
Seung-Hyeon Song (Internship)
Research Interests
Semiconductor Packaging
E-mail lookingforx@hanyang.ac.kr
Jun-Bin Kim (Internship)
Research Interests
Lx semicon 방열 해석
WPG 예측
E-mail qlsqls7351@hanyang.ac.kr
Sang-Baek Jo (Internship)
Research Interests
Non-destructive evaluation (NDE) using THz wave Semiconductor packaging inspection
E-mail gg3532@hanyang.ac.kr
Do-Hyun Kim (Internship)
Research Interests
Interconnection study
E-mail semira2448@hanyang.ac.kr
Ho-Chan Jung (Internship)
Research Interests
Semiconductor Packaging
E-mail yd20531@hanyang.ac.kr
Seok-Yeong Lee (Internship)
Research Interests
Interconnection
E-mail antk1255@hanyang.ac.kr
Jin-Woo Jung (Internship)
Research Interests
Non-destructive evaluation (NDE) using THz wave Semiconductor packaging inspection
E-mail immortaljeb@hanyang.ac.kr
Min-Hyeok Jeon (Internship)
Research Interests
Semiconductor packaging inspection
E-mail jmh4645@hanyang.ac.kr
