Young-Min Ju (Ph.D. course)
Research Interests
Semiconductor packaging
Printed electronics
Reinforcement learning
E-mail zenicmin1111@gmail.com
Sang-Il Kim (Ph.D. course)
Research Interests
Non-destructive evaluation (NDE) using THz wave
Semiconductor packaging inspection
Deep neural network
E-mail sangilkim01@gmail.com
Se-Min Lee (Ph.D course)
Research Interests
Split hopkinson pressure bar
PKG interfacial properties
Deep learning algorithm
E-mail minhappy96@hanyang.ac.kr
Na-Hyun Jeon (M.S. course)
Research Interests
Composite Materials
Semiconductor Packaging
Deep neural network
E-mail nahyun.j11@gmail.com
You-Gwon Kim (Ph.D. course)
Research Interests
Semiconductor Packing Solder reliability
Hybrid bonding
Fluxless bonding
Deep neural network
E-mail yougwon1@gmail.com
Gyu-Won Kim (Ph.D. course)
Research Interests
Composite Materials
Semiconductor Packaging
Deep neural network
E-mail kyuwon817@gmail.com
Tae-Wan Kim (Ph.D. course)
Research Interests
Semiconductor Packing Solder reliability,
Non-destructive evaluation (NDE) using THz wave,
Semiconductor packaging inspection
E-mail kty98031314@gmail.com
Woong-Kyoo Yoo (Ph.D. course)
Research Interests
E-mail ywk1105@gmail.com
Hyun-Ji Rho (M.S. course)
Research Interests
E-mail rhj333221@gmail.com
Young-Woo Kim (M.S. course)
Research Interests
E-mail kimyoungwoo8189@gmail.com
Taek-Hyeon kim (M.S. course)
Research Interests
E-mail taekhyeon24222@gmail.com
Jae-Sung Kim (Ph.D. course)
Research Interests
E-mail jaesungk77@gmail.com
SeungHyun Lee (M.S. course)
Research Interests
Composite Materials
PKG interfacial properties
Deep learning algorithm
E-mail leesh8297@gmail.com
Hyeong-Bin Park (M.S. course)
Research Interests
Semiconductor Packaging Solder reliability
Hybrid bonding reliability
E-mail zbxb990821@gmail.com
Jun-Seop Song (M.S. course)
Research Interests
Composite Materials
Semiconductor Packaging
E-mail seop7147@gmail.com
Hyun-Jin Jung (M.S. course)
Research Interests
Non-destructive evaluation (NDE) using THz wave Semiconductor packaging inspection
E-mail hyunname98@gmail.com
Kang Hee Kim (Administrative Assistant)
Research Interests
E-mail egao95@hanyang.ac.kr
Suk Hyung Song (Packaging Fab Manager)
Research Interests
E-mail tjgud0404@hanyang.ac.kr
Dong-Hoon Yoo (M.S. course)
Research Interests
Semiconductor Packaging Solder reliability
Split Hopkinson pressure bar
Hybrid bonding reliability
E-mail ydonghoon98@gmail.com
Ho-Jin Lee (M.S. course)
Research Interests
Semiconductor packaging reliability (RDL, interconnection)
Corrosion analysis and reliability
E-mail lhj0699@gmail.com
Se-Jun Park (M.S. course)
Research Interests
Corrosion analysis and reliability
Deep learning algorithm
Semiconductor Packaging
E-mail ddl07113s@gmail.com
Min-Woo Jeon (Internship course)
Research Interests
Non-destructive evaluation (NDE) using THz wave Semiconductor packaging inspection
E-mail minwoo5963@gmail.com
Sanjay Kumar (Post doctoral)
Research Interests
E-mail sanjaykumarbind93@gmail.com
Yun-Joong Kim (Internship course)
Research Interests
Semiconductor Packaging (Glass Interposer, RDL, Signal Integrity)
Semiconductor Device Fabrication
IPL bump
E-mail yunjoongkim1216@gmail.com
Hee-Ju Han (M.S. course)
Research Interests
Semiconductor Packaging
Signal integrity
E-mail hhju1024@gmail.com
Woo-Jin An (Internship course)
Research Interests
E-mail ahnwoojinsk37@gmail.com
Chae-Young Ahn (M.S. course)
Research Interests
Semiconductor Packaging
Composite Materials
E-mail avery.ahn57@gmail.com
Hae-Su Ahn (Internship course)
Research Interests
E-mail haesoo0907@gmail.com
Young-Taek Oh (Internship course)
Research Interests
E-mail oytec5012@gmail.com
