About Us
In this laboratory, we perform a multi-disciplinary research on a variety of topics, such as printed electronics, semiconductor packaging, reliability studies, energy storage research body, the functinal composites
LAB NEWS
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- · 2021년 다기능성복합재료 (MCDM) 연구실 인턴 모집 공고 2021-02-26
- · 다기능성복합재료 (MCDM) 연구실 인턴 모집 공고 2020-11-24
- · 기계공학부 김학성 교수 HYU 학술상 수상 2019-12-20
PHOTOS
Research Areas
Printed electronics
Printed electronics is electronic device or electronics made by using printing methods.
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Structural Composites
The mechanical components need to have light weight and high strength
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Nondestructive Evaluation with THz
Terahertz waves can be used for Non-Destructive Evaluation in manufacturing, quality control, and process monitoring.
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Semiconductor packaging technology
Market occupation of high density memory products such as smart phone and tablet PD is increasing rapidly.
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