About Us
In this laboratory, we perform a multi-disciplinary research on a variety of topics, such as printed electronics, semiconductor packaging, reliability studies, energy storage research body, the functinal composites
LAB NEWS
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- · [미래기술 R&D 현장] 한양대 'EUV노광기술연구센터' 전자신문 게재 2022-09-19
- · 다기능성복합재료(MCDM) 연구실 장용래 박사, 박사학위 우수논문상 수상 2022-08-11
- · [축] 다기능성 복합재료 설계 및 제조 연구실 졸업생 김동현 박사 한국원자력연구원 선임연구원 임용 2022-07-04
PHOTOS
Research Areas
Printed electronics
Printed electronics is electronic device or electronics made by using printing methods.
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Structural Composites
The mechanical components need to have light weight and high strength
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Nondestructive Evaluation with THz
Terahertz waves can be used for Non-Destructive Evaluation in manufacturing, quality control, and process monitoring.
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Semiconductor packaging technology
Market occupation of high density memory products such as smart phone and tablet PD is increasing rapidly.
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