About Us
In this laboratory, we perform a multi-disciplinary research on a variety of topics, such as printed electronics, semiconductor packaging, reliability studies, energy storage research body, the functinal composites
LAB NEWS
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- · 융합기계공학과 첨단 반도체패키징 혁신(APIL) 연구실 김학성 교수님 한국비파괴검사학회 과학기술우수논문상 수상 2025-07-15
- · [한양 뉴스 포털 NEWS H] 한양대 김학성·이승환 교수팀, 반도체 접착력 정밀 측정기술 개발로 신뢰성 향상 이끈다 2025-07-11
- · [교수신문] 한양대 김학성·이승환 교수팀, 반도체 계면 접착력 측정 ‘ 2025-06-18
PHOTOS
Research Areas
Printed electronics
Printed electronics is electronic device or electronics made by using printing methods.
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Structural Composites
The mechanical components need to have light weight and high strength
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Nondestructive Evaluation with THz
Terahertz waves can be used for Non-Destructive Evaluation in manufacturing, quality control, and process monitoring.
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Semiconductor packaging technology
Market occupation of high density memory products such as smart phone and tablet PD is increasing rapidly.
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