About Us
In this laboratory, we perform a multi-disciplinary research on a variety of topics, such as printed electronics, semiconductor packaging, reliability studies, energy storage research body, the functinal composites
LAB NEWS
융합기계공학과 APIL 연구실 주영민 박사과정 연구원, 류성웅 석사 연구원 “Ultra milli-second flip-chip bonding process via intense pulsed light irradiation” 논문 , ACS Applied Materials & Interfaces(Q1, IF 8.5) 표지 논문으로 선정
2025-06-11
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융합기계공학과 APIL 연구실 Sanjay Kumar 박사 후 연구원, Q1 저널 Composite Part B: Engineering (IF 12.7) 논문 개제
2025-06-09
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융합기계공학과 APIL 연구실 주영민 박사과정 연구원, Q1 저널 Applied Surface Science Advances (IF 7.5) 논문 게재
2025-06-08
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- · [파이낸셜 뉴스] '반도체 접합 공정을 1596배 빠르게' 전자신문 게재 2025-06-17
- · 융합기계공학과 APIL 연구실 주영민 박사과정 연구원, 류성웅 석사 연구원 “Ultra milli-second flip-chip bonding process via intense pulsed light irradiation” 논문 , ACS Applied Materials & Interfaces(Q1, IF 8.5) 표지 논문으로 선정 2025-06-11
- · 융합기계공학과 APIL 연구실 Sanjay Kumar 박사 후 연구원, Q1 저널 Composite Part B: Engineering (IF 12.7) 논문 개제 2025-06-09
PHOTOS
Research Areas
Printed electronics
Printed electronics is electronic device or electronics made by using printing methods.
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Structural Composites
The mechanical components need to have light weight and high strength
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Nondestructive Evaluation with THz
Terahertz waves can be used for Non-Destructive Evaluation in manufacturing, quality control, and process monitoring.
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Semiconductor packaging technology
Market occupation of high density memory products such as smart phone and tablet PD is increasing rapidly.
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