Jae-Jun Kim (Internship)
Research Interests
Semiconductor Packaging Solder reliability
Hybrid bonding
E-mail jaejun0905@hanyang.ac.kr
Hyun-Seok Kim (Internship)
Research Interests
Non-destructive evaluation (NDE) using THz wave Semiconductor packaging inspection
E-mail apo920@hanyang.ac.kr
Seung-Hyeon Song (Internship)
Research Interests
Semiconductor Packaging
E-mail lookingforx@hanyang.ac.kr
Jun-Bin Kim (Internship)
Research Interests
Lx semicon 방열 해석
WPG 예측
E-mail qlsqls7351@hanyang.ac.kr
Sang-Baek Jo (Internship)
Research Interests
Non-destructive evaluation (NDE) using THz wave Semiconductor packaging inspection
E-mail gg3532@hanyang.ac.kr
Do-Hyun Kim (Internship)
Research Interests
Interconnection study
E-mail semira2448@hanyang.ac.kr
Ho-Chan Jung (Internship)
Research Interests
Semiconductor Packaging
E-mail yd20531@hanyang.ac.kr
Seok-Yeong Lee (Internship)
Research Interests
Interconnection
E-mail antk1255@hanyang.ac.kr
Jin-Woo Jung (Internship)
Research Interests
Non-destructive evaluation (NDE) using THz wave Semiconductor packaging inspection
E-mail immortaljeb@hanyang.ac.kr
Min-Hyeok Jeon (Internship)
Research Interests
Semiconductor packaging inspection
E-mail jmh4645@hanyang.ac.kr
