ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 356 |
2023 한국마이크로전자 및 패키징 학회 (KMEPS)Double-sided Warpage free Package StructureWoong-Kyoo Yoo, Jeong-Hyeon Baek, Jong-Whi Park, and Hak-Sung Kim |
2023.04 |
| 355 |
2023 한국마이크로전자 및 패키징 학회 (KMEPS)Prediction of semiconductor package behavior according to the curing process conditions of epoxy molding compoundHui-Jin Um, Young-Min Ju, Dae-Woong Lee, Sangyul Ha, and Hak-Sung Kim |
2023.04 |
| 354 |
IEEE Electron Devices Technology and Manufacturing(EDTM) Conference 2023Prediction of crack type and fatigue life of printed circuit board under thermal cycling with respect to solder compositionHeon-Su Kim, You-Gwon Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee and Hak-Sung Kim |
2023.03 |
| 353 |
IEEE Electron Devices Technology and Manufacturing(EDTM) Conference 2023Prediction of delamination at interface of printed circuit board/epoxy molding compound under mixed-mode loadingHui-Jin Um, Se-Min Lee, Dae-Woong Lee, Sangyul Ha, and Hak-Sung Kim |
2023.03 |
| 352 |
IEEE Electron Devices Technology and Manufacturing(EDTM) Conference 2023Lifetime prediction of the printed circuit board under marine atmosphere condition using numerical simulation methodSang-Il Kim, Dug-Joong Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
2023.03 |