ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 346 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Prediction of Solder Fatigue Life of Package by Automated Parametric Modeling Simulation TechniqueHeon-Su Kim, You-Gwon Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
2022.11 |
| 345 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Warpage simulation of bi-material strip by the effective cure shrinkage measurement of EMC using dielectric and FBG sensorsJeong-Hyeon Baek, Dong-Woon Park, Han-Sung Ryu, Gyung-Hwan Oh, and Hak-Sung Kim |
2022.11 |
| 344 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Corrosion lifetime prediction of printed circuit board under marine atmosphere condition using numerical simulation methodSang-Il Kim, Dug-Joong Kim, Do-Hyung Kim, Dong-Min Jang,Jin-Woo Jang, Seong-Yeong Lee, and Hak-Sung Kim |
2022.11 |
| 343 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Prediction of crack type and fatigue life of printed circuit board with respect to solder composition under repeated thermal cycleYou-Gwon Kim, Heon-Su Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
2022.11 |
| 342 |
Korean International Semiconductor Conference on Manufacturing Technology (KISM 2022)The study of the fabrication of thin film transistor using molybdenum electrode sintered by intense pulsed light sintering process with non-vacuum and room temperature processedJong-Whi Park, and Hak-Sung Kim |
2022.11 |