MCDM LAB
MCDM LAB
ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 343 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Prediction of crack type and fatigue life of printed circuit board with respect to solder composition under repeated thermal cycleYou-Gwon Kim, Heon-Su Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
2022.11 |
| 342 |
Korean International Semiconductor Conference on Manufacturing Technology (KISM 2022)The study of the fabrication of thin film transistor using molybdenum electrode sintered by intense pulsed light sintering process with non-vacuum and room temperature processedJong-Whi Park, and Hak-Sung Kim |
2022.11 |
| 341 |
Korean International Semiconductor Conference on Manufacturing Technology (KISM 2022)Warpage simulation with consideration of a cure shrinkage of EMC measured using FBG sensor and dielectric sensorJeong-Hyeon Baek, Dong-Woon Park, Han-Sung Ryu, Gyung-Hwan Oh, and Hak-Sung Kim |
2022.11 |
| 340 |
Korean International Semiconductor Conference on Manufacturing Technology (KISM 2022)The Fabrication of Thin Film Transistor with Silver Nanowire Bottom Gate Electrode Welded by Intense Pulsed Light Welding Process with Simultaneous Mechanical Roll-PressingYoung-Min Ju, Jong-Whi Park, and Hak-Sung Kim |
2022.11 |
| 339 |
Korean International Semiconductor Conference on Manufacturing Technology (KISM 2022)Thermal fatigue life-prediction of microelectronics package with respect to solder type under repeated thermal cycle testYou-Gwon Kim, Heon-Su Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
2022.11 |