MCDM LAB
MCDM LAB
ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 181 |
기계저널경량 신소재 복합 재료의 고속 변형률 거동 및 충돌 성능 예측 및 응용김학성 |
61(9) | 33-38 | 2021-09-02 |
| 180 |
Scientific ReportsFabrication of Solderable Intense Pulsed Light Sintered Hybrid Copper for Flexible Conductive ElectrodesYong-Rae Jang, Robin Jeong, Hak-Sung Kim, Simon S. Park |
11 | 14551 | 2021-07-15 |
| 179 |
Composite structuresStudy on inter-ply friction between woven and unidirectional prepregs and ints effect on the composite forming processJeong-Yeop Kim, Yeon-Taek Hwang, Jeon-Hyeon Baek, Won-Yong Song, Hak-Sung Kim |
267 | 113888 | 2021-07-01 |
| 178 |
Composite ResearchDetection of Fine Delamination in Glass Fiber Reinforced Polymer Analyzing Full Width Half Maximum of Superimposed Terahertz SignalHeon-Su Kim, Dong-Woon Park, Sang-Il Kim, and Hak-Sung Kim |
34(3) | 143-147 | 2021-06-22 |
| 177 |
Microelectronics ReliabilityFinite element analysis of moisture induced thermo-mechanical delamination of semiconductor packages considering in-situ moisture desorption during reflow processYeon-Taek Hwang, Hui-Jin Um, Myeong-Hyeon Yu, Dae-Woong Lee, Mi-Jung Lee, Hak-Sung Kim |
121 | 114146 | 2021-06-01 |