ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 222 |
Nano ConvergenceAdvanced WBG Power Semiconductor Packaging: Nanomaterials and Nanotechnologies for High-Performance Die Attach PasteYoung-Min Ju, Tae-Wan Kim, Seung-Hyun Lee, Jinho Ahn and Hak-Sung Kim |
(Submitted) | 99999.99.9 | |
| 221 |
Applied Surface Science AdvancesMeasurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation testYoung-Min Ju, Dukyong Kim, Se-Min Lee, Heuisu Kim, Daewoong Lee, Yeontaek Hwang, Seung Hwan Lee and Hak-Sung Kim |
(Accepted) | 9999.99.99 | |
| 220 |
Polymer TestingNon-destructive evaluation of PET thermal degradation using terahertz time domain spectroscopyTae-Wan Kim, Sang-Il Kim, Hyun-Jin Jung, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 219 |
Transactions on Pattern Analysis and Machine IntelligenceFast warpage prediction of printed circuit board with the automatically classified copper patterns for anisotropic viscoelastic homogenizationWoong-Kyoo Yoo,Jeong-Hyeon Baek,Jong-Whi Park,Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 218 |
NDT & E InternationalIn-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electro-magnetic waveHeon-Su Kim, Sang-Il Kim, Tae-Wan Kim, Jin-Sang Lim, Dong-Su Han, Hae-Gu Lee, and Hak-Sung Kim |
(Sumitted) | 9999.99.99 |