ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 223 |
Materials & DesignEffect of electroplating current density and post-annealing on the warpage and reliability of redistributed layer for advanced semiconductor packageTaek-Hyeon Kim, Jeong-Hyeon Baek, Sang-Il Kim, Tae-Hoon Kim, Ji-Hye Shim and Hak-Sung Kim |
(Submitted) | 99999.99.99 | |
| 222 |
Composite Part BIntegrated Design and Validation of a 3D Radiant Heater for Electrical Vehicles: Thermo-Electrical Finite Element Analysis Considering Strain-Dependent Resistance in Thermo-Forming ProcessJeong-Hyeon Baek, Tae-In Park, Yoon-Jin Kim, Ji-Sun Park and Hak-Sung Kim |
(Submitted) | 99999.99.99 | |
| 221 |
Nano ConvergenceAdvanced WBG Power Semiconductor Packaging: Nanomaterials and Nanotechnologies for High-Performance Die Attach PasteYoung-Min Ju, Tae-Wan Kim, Seung-Hyun Lee, Jinho Ahn and Hak-Sung Kim |
(Revised) | 99999.99.9 | |
| 220 |
Journal of Materials Research and TechnologySynergistic Role of Bi, Ni, and Pd Alloying in SAC305 for Enhanced IMC Suppression and Superior Thermo-Mechanical PerformanceYou-Gwon Kim, Heon-Su Kim, Tae Wan Kim, Hyeong-Bin Park, Jong-Whi Park, Yongrae Jang, Bongtae Han, Jun-Hyeong Lee, Jin Gyu Kim, Hak-Sung Kim |
(Revised) | 99999-99-99 | |
| 219 |
Materials & DesignNon-destructive evaluation of PET thermal degradation using terahertz time domain spectroscopyTae-Wan Kim, Sang-Il Kim, Hyun-Jin Jung, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim |
(Submitted) | 9999.99.99 |