ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 229 |
Results in engineeringNon-destructive evaluation of PET thermally induced structural transformation using terahertz time domain spectroscopyTae-Wan Kim, Sang-Il Kim, Heon-Su Kim, Chang-Jin Moon and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 228 |
Journal of Materials Processing TechnologyMulti-Physics Coupled Modeling of Process-Induced Warpage in Advanced Fan-Out Wafer-Level Semiconductor PackagesJeong-Hyeon Baek, Jun-Seop Song, Woong-Kyoo Yoo, Woo-Jin An , Gyung-Hwan Oh, Dong-Woon Park, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 227 |
Composites Part ADevelopment of the modified V-notched rail shear test for carbon fiber reinforced composites with multi-scale simulation method considering microscopic failure pointsGyu-Won Kim, Hyun-Ji Rho, Young-Wu Kim, Jun-Seop Song, Woe-Tae Kim, Dong-Hwi Kim, Jong-Whi Park, and Hak-Sung Kim |
(Accepted) | 9999-99-99 | |
| 226 |
Sensors and Actuators A: PhysicalMicrostructured anisotropic PDMS sheet for damage-free electrical testing of semiconductor packagesYu-lim Seol, Jae-heon Jeong, Ji-Hye Shim, Hak-Sung Kim, Hong-yun So |
399 | 117393 | 2025.12.10 |
| 225 |
MeasurementIn-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electromagnetic wavesSang-Il Kim, Heon-Su Kim, Tae-Wan Kim, Jinsang Lim, Dong-Su Han, Hae Gu Lee, and Hak-Sung Kim |
262 | 120035 | 2025.12.09 |