MCDM LAB

Multifunctional Composite Design and Manufacturing Laboratory
번호 제목 권(호) 출판년도
25

Journal of the Microelectronics and Packaging Society

Solder Alloy Types and Solder Joint Reliability Evaluation Techniques

You-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Hak-Sung Kim

30(1) 17-29 2023-03-30
24

Journal of the Microelectronics and Packaging Society

Delamination Prediction of Semiconductor Packages through Finite Element Analysis Reflecting Moisture Absorption and Desorption according to the Temperature and Relative Humidity

Hui-Jin Um, Yeon-Taek Hwang, Hak-Sung Kim

29(3) 37-42 2022-09-29
23

Journal of the Microelectronics and Packaging Society

Development of Warpage Simulation Method according to Thermal Stress based on Equivalent Anisotropic Viscoelastic Model

Heon-Su Kim, Hak-Sung Kim

29(3) 43-48 2022-09-29
22

Journal of the Microelectronics and Packaging Society

A Study on Effect of Pad Design on Assembly and Adhesion Reliability of Surface Mount Technology (SMT)

Dong-Woon Park, Myeong-Hyeon Yu, Hak-Sung Kim

29(3) 31-35 2022-09-29
21

Composites Research

Study on the Split Hopkinson Pressure Bar Apparatus for Measuring High-strain Rate Tensile Properties of Plastic Material

In-Soo Han, Se-Min Lee, Gyu-Won Kim, Hak-Sung Kim

35(1) 196-200 2022-06-30