MCDM LAB
MCDM LAB
ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 29 |
Composites ResearchStrain Rate and Temperature Effects on TPO and PP for Enhanced Airbag Deployment SimulationSe-Min Lee, Gyu-Won Kim,Jae-Hyun Ahn, In-Soo Han, Hak-Sung Kim |
37 | 325-329 | 2024-08-31 |
| 28 |
비파괴검사학회지딥러닝과 테라헤르츠 기술을 이용한 세라믹-폴리머-금속 복합체 내부 결함 검사에 관한 연구You-Gwon Kim, Sang-Il Kim, Heon-Su Kim, Hak-Sung Kim |
44(3) | 172-179 | 2024-06-14 |
| 27 |
비파괴검사학회지테라헤르츠파를 사용한 반도체 패키지 내부 칩 정렬 비파괴 검사 기술에 관한 연구Sang-Il Kim, Heon-Su Kim, Hak-Sung Kim |
44(3) | 165-171 | 2024-06-14 |
| 26 |
Journal of the Microelectronics and Packaging SocietySolder Alloy Types and Solder Joint Reliability Evaluation TechniquesYou-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Hak-Sung Kim |
30(1) | 17-29 | 2023-03-30 |
| 25 |
Journal of the Microelectronics and Packaging SocietyMeasurement of effective cure shrinkage of EMC using dielectric sensor and FBG sensorJeong-hyeon Baek, Dong-woon Park and Hak-sung Kim |
29(4) | 83-87 | 2022-12-30 |