MCDM LAB
MCDM LAB
ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 28 |
Journal of the Korean Society for Nondestructive TestingInspection of Internal Defects in Ceramic-polymer-metal Composites Using Terahertz Time-Domain Spectroscopy and Deep LearningYou-Gwon Kim, Sang-Il Kim, Heon-Su Kim, Hak-Sung Kim |
3(44) | 172-179 | 2024-06 |
| 27 |
Journal of the Korean Society for Nondestructive TestingNon-destructive Inspection Technique Using a Terahertz Wave to Inspect the Alignment of the Internal Chip in Semiconductor PackageSang-Il Kim, Heon-Su Kim, Hak-Sung Kim |
3(44) | 165-171 | 2024-06 |
| 26 |
Journal of the Microelectronics and Packaging SocietySolder Alloy Types and Solder Joint Reliability Evaluation TechniquesYou-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Hak-Sung Kim |
30(1) | 17-29 | 2023-03-30 |
| 25 |
Journal of the Microelectronics and Packaging SocietyMeasurement of effective cure shrinkage of EMC using dielectric sensor and FBG sensorJeong-hyeon Baek, Dong-woon Park and Hak-sung Kim |
29(4) | 83-87 | 2022-12-30 |
| 24 |
Journal of the Microelectronics and Packaging SocietyDelamination Prediction of Semiconductor Packages through Finite Element Analysis Reflecting Moisture Absorption and Desorption according to the Temperature and Relative HumidityHui-Jin Um, Yeon-Taek Hwang, Hak-Sung Kim |
29(3) | 37-42 | 2022-09-29 |