ACHIEVEMENT
번호 | 제목 | 권(호) | 쪽 | 출판년도 |
---|---|---|---|---|
25 |
Journal of the Microelectronics and Packaging SocietySolder Alloy Types and Solder Joint Reliability Evaluation TechniquesYou-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Hak-Sung Kim |
30(1) | 17-29 | 2023-03-30 |
24 |
Journal of the Microelectronics and Packaging SocietyDelamination Prediction of Semiconductor Packages through Finite Element Analysis Reflecting Moisture Absorption and Desorption according to the Temperature and Relative HumidityHui-Jin Um, Yeon-Taek Hwang, Hak-Sung Kim |
29(3) | 37-42 | 2022-09-29 |
23 |
Journal of the Microelectronics and Packaging SocietyDevelopment of Warpage Simulation Method according to Thermal Stress based on Equivalent Anisotropic Viscoelastic ModelHeon-Su Kim, Hak-Sung Kim |
29(3) | 43-48 | 2022-09-29 |
22 |
Journal of the Microelectronics and Packaging SocietyA Study on Effect of Pad Design on Assembly and Adhesion Reliability of Surface Mount Technology (SMT)Dong-Woon Park, Myeong-Hyeon Yu, Hak-Sung Kim |
29(3) | 31-35 | 2022-09-29 |
21 |
Composites ResearchStudy on the Split Hopkinson Pressure Bar Apparatus for Measuring High-strain Rate Tensile Properties of Plastic MaterialIn-Soo Han, Se-Min Lee, Gyu-Won Kim, Hak-Sung Kim |
35(1) | 196-200 | 2022-06-30 |