Multifunctional Composite Design and Manufacturing Laboratory
번호 제목 권(호) 출판년도

Journal of the Microelectronics and Packaging Society

Delamination Prediction of Semiconductor Packages through Finite Element Analysis Reflecting Moisture Absorption and Desorption according to the Temperature and Relative Humidity

Hui-Jin Um, Yeon-Taek Hwang, Hak-Sung Kim

29(3) 37-42 2022-09-29

Journal of the Microelectronics and Packaging Society

Development of Warpage Simulation Method according to Thermal Stress based on Equivalent Anisotropic Viscoelastic Model

Heon-Su Kim, Hak-Sung Kim

29(3) 43-48 2022-09-29

Journal of the Microelectronics and Packaging Society

A Study on Effect of Pad Design on Assembly and Adhesion Reliability of Surface Mount Technology (SMT)

Dong-Woon Park, Myeong-Hyeon Yu, Hak-Sung Kim

29(3) 31-35 2022-09-29

Composites Research

Study on the Split Hopkinson Pressure Bar Apparatus for Measuring High-strain Rate Tensile Properties of Plastic Material

In-Soo Han, Se-Min Lee, Gyu-Won Kim, Hak-Sung Kim

35(1) 196-200 2022-06-30

Journal of the Korean Society for Nondestructive Testing

Detecting defects in a polymer tube using terahertz and deep learning technique

Sang-Il Kim, Dong-Woon Park, Heon-Su Kim and Hak-Sung Kim

42(2) 129-135 2022-04-27