ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 199 |
Journal of the Microelectronics and Packaging SocietyDevelopment of Warpage Simulation Method according to Thermal Stress based on Equivalent Anisotropic Viscoelastic ModelHeon-Su Kim, Hak-Sung Kim |
29(3) | 43-48 | 2022-09-29 |
| 198 |
Journal of the Microelectronics and Packaging SocietyA Study on Effect of Pad Design on Assembly and Adhesion Reliability of Surface Mount Technology (SMT)Dong-Woon Park, Myeong-Hyeon Yu, Hak-Sung Kim |
29(3) | 31-35 | 2022-09-29 |
| 197 |
Materials Science in Semiconductor ProcessingEffect of cure shrinkage of epoxy molding compound on warpage behavior of semiconductor packageJeong-Hyeon Baek, Dong-Woon Park, Gyung-Hwan Oh, Dong-Ok Kawk, Simon S. Park and Hak-Sung Kim |
148 | 106758 | 2022-09-01 |
| 196 |
Composite Structures3D printed continuous carbon fiber reinforced thermoplastic composite sandwich structure with corrugated core for high stiffness/load capabilityHui-Jin Um, Ji-Seok Lee, Ji-Hwan Shin, Hak-Sung Kim |
291 | 115590 | 2022-07-01 |
| 195 |
Composites ResearchStudy on the Split Hopkinson Pressure Bar Apparatus for Measuring High-strain Rate Tensile Properties of Plastic MaterialIn-Soo Han, Se-Min Lee, Gyu-Won Kim, Hak-Sung Kim |
35(1) | 196-200 | 2022-06-30 |