번호 제목 권(호) 출판년도
179

Scientific Reports

Fabrication of Solderable Intense Pulsed Light Sintered Hybrid Copper for Flexible Conductive Electrodes

Yong-Rae Jang, Robin Jeong, Hak-Sung Kim, Simon S. Park

11 14551 2021-07-15
178

Composite structures

Study on inter-ply friction between woven and unidirectional prepregs and ints effect on the composite forming process

Jeong-Yeop Kim, Yeon-Taek Hwang, Jeon-Hyeon Baek, Won-Yong Song, Hak-Sung Kim

267 113888 2021-07-01
177

Composite Research

Detection of Fine Delamination in Glass Fiber Reinforced Polymer Analyzing Full Width Half Maximum of Superimposed Terahertz Signal

Heon-Su Kim, Dong-Woon Park, Sang-Il Kim, and Hak-Sung Kim

34(3) 143-147 2021-06-22
176

Microelectronics Reliability

Finite element analysis of moisture induced thermo-mechanical delamination of semiconductor packages considering in-situ moisture desorption during reflow process

Yeon-Taek Hwang, Hui-Jin Um, Myeong-Hyeon Yu, Dae-Woong Lee, Mi-Jung Lee, Hak-Sung Kim

121 114146 2021-06-01
175

Materials Today Communications

Measurement and investigation of mechanical properties of a partial oxide dispersion strengthened Zircaloy-4 tube via an instrumented indentation test

Dong-Hyun Kim, Jong-Dae Hong, Hyochan Kim, Jaeyong Kim, Hak-Sung Kim, and Hwanuk Guim

27 102210 2021-06-01