ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 159 |
Materials & DesignsPrediction of fatigue life of semiconductor package under thermal cycling: combined effect of package design and solder materialsHeon-Su Kim, You-Gwon Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
999 | 202-05-05 | |
| 158 |
AIP AdvancesDirect evaluation method to measure permittivity and conductivity of thin layers via wave approach in the THz regionYun-Sang Kwak, Sang-Mok Park, Sin-Yeob Lee, Hak-Sung Kim, Ju Lee and Jun-Hong Park |
9(11) | 115113 | 2019-11-20 |
| 157 |
Composites Part BPredicting the stacking sequence of E-glass fiber reinforced polymer (GFRP) epoxy composite using terahertz time-domain spectroscopy (THz-TDS) systemDong-Woon Park, Gyung-Hwan Oh and Hak-Sung Kim |
177 | 107385 | 2019-11-15 |
| 156 |
Composite ResearchDevelopment of Modeling Technique and Material Prediction Method Considering Structural Characteristics of Woven CompositesKyung-Hee Choi, Yeon-Taek Hwang, Hee-June Kim and Hak-Sung Kim |
32 | 206-210 | 2019-10-31 |
| 155 |
Composite StructuresProgressive failure analysis of woven composites considering structural characteristics based on micro-mechanicsKyung-Hee Choi, Yeon-Taek Hwang, Hee-June Kim and Hak-Sung Kim |
224 | 110990 | 2019-09-15 |