MCDM LAB

Multifunctional Composite Design and Manufacturing Laboratory
번호 제목 권(호) 출판년도
90

IEEE Transactions on Components, Packaging and Manufacturing Technology

Warpage Simulation of a Multilayer Printed Circuit Board and Microelectronic Package Using the Anisotropic Viscoelastic Shell Modeling Technique That Considers the Initial Warpage

Do-Hyoung Kim, Sung-Jun Joo, Dong-Ok Kwak, and Hak-Sung Kim*

6(11) 1667-1676 2016-10-10
89

Scientific Reports

Welding of silver nanowire networks via flash white light and UV-C irradiation for highly conductive and reliable transparent electrodes

Wan-Ho Chung, Sang-Ho Kim and Hak-Sung Kim*

6 32086 2016-08-24
88

Journal of Mechanical Science and Technology

In vivo stiffness measurement and in silico stiffness prediction of biceps brachii muscle using an isometric contraction exercise

Wan-Ho Chung, Dong-Ki Min, Hyun-Jun Hwang, Jong-Kwang Lim, Jun-Hong Park* and Hak-Sung Kim*

30(6) 2881-2889 2016-06-30
87

Composite Structures

Dependence of polymer concrete vibration characteristics on internal pipe and damper embedment

Eun-Beom Jeon, Sang-Keun Ahn, Won-Seok Yang, Hyo-In Kohm, Hak-Sung Kim* and Jun-Hong Park*

143 347-351 2016-05-20
86

Nanotechnology

Electrical wire explosion process of copper/silver hybrid nano-particle ink and its sintering via flash white light to achieve high electrical conductivity

Wan-Ho Chung, Yeon-Teak Hwang, Seung-Hyun Lee and Hak-Sung Kim

27(20) 205704 2016-04-11