ACHIEVEMENT
번호 | 제목 | 권(호) | 쪽 | 출판년도 |
---|---|---|---|---|
20 |
Composites Science and TechnologyReduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometryHak Sung Kim and Dai Gil Lee |
67 | 29-44 | 2007-01-01 |
19 |
Composite StructuresDesign and manufacture of stainless steel/carbon epoxy hybrid shaft for cleaning large LCD glass panelHak Sung Kim and Dai Gil Lee |
80 | 279-289 | 2007-01-01 |
18 |
Microelectronics ReliabilityInvestigation of moisture induced failures of stacked-die packageHak Sung Kim, Ho Geon Song |
47 | 1673-1679 | 2007-01-01 |
17 |
Composite StructuresDevelopment of Heavy duty Hybrid Carbon-Phenolic Hemispherical BearingsDong Chang Park, Seung Min Lee, Byung Chul Kim, Hak Sung Kim and Dai Gil Lee |
73 | 88-98 | 2006-01-01 |
16 |
Journal of Adhesion Science and TechnologyAvoidance of fabricational thermal residual stress of co-cure bonded metal/composite hybrid structuresHak Sung Kim and Dai Gil Lee |
20(9) | 959-979 | 2006-01-01 |