ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 175 |
Materials Science in Semiconductor ProcessingEffect of cure shrinkage of epoxy molding compound on warpage behavior of semiconductor packageJeong-Hyeon Baek, Dong-Woon Park, Gyung-Hwan Oh, Dong-Ok Kawk, Simon S. Park and Hak-Sung Kim |
148 | 106758 | 2022-09-01 |
| 174 |
Composite Structures3D printed continuous carbon fiber reinforced thermoplastic composite sandwich structure with corrugated core for high stiffness/load capabilityHui-Jin Um, Ji-Seok Lee, Ji-Hwan Shin, Hak-Sung Kim |
291 | 115590 | 2022-07-01 |
| 173 |
Composites Part: BDesign and manufacture of thermoplastic carbon fiber/polyethylene terephthalate composites underbody shield to protect the lithium-ion batteries for electric mobility from ground impactHui-Jin Um, Yeon-Taek Hwang, Il-Joon Bae, and Hak-Sung Kim |
238 | 109892 | 2022-06-01 |
| 172 |
Nuclear Engineering and TechnologyStudy of the mechanical properties and effects of particles for oxide dispersion strengthened Zircaloy-4 via a 3D representative volume element modelDong-Hyun Kim, Jong-Dae Hong, Jae-yong Kim, Hak-Sung Kim, Hyo-chan Kim |
54(5)(5) | 1549-1559 | 2022-05-01 |
| 171 |
Applied Thermal EngineeringThermal simulation trained deep neural networks for fast and accurate prediction of thermal distribution and heat losses of building structuresDug-Joong Kim, Sang-Il Kim and Hak-Sung Kim |
202(117908) | 117908 | 2022-02-05 |