ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 142 |
NDT & E InternationalIn-situ thickness measurement of epoxy molding compound in semiconductor package products using a Terahertz-Time of Flight SystemDong-Woon Park, Gyung-Hwan Oh, Dug-joong Kim and Hak-sung Kim |
105 | 15-18 | 2019-07-01 |
| 141 |
Thin Solid FilmsDevelopment of a via-hole connection process via intense pulsed light sintering with Cu micro/Ag nano-hybrid ink for a multi-layered flexible printed circuit boardJi-Hyeon Chu, Sung-Jun Joo and Hak-sung Kim |
680 | 1-11 | 2019-06-30 |
| 140 |
Nuclear Science and TechnologyDevelopment of FRACAS-CT module with FRAPCON4.0P01 for simulation of mechanical behaviors for accident-tolerant fuel cladding in a reactorDong-Hyun Kim, Hyo-Chan Kim and Hak-Sung Kim |
56(8) | 671-683 | 2019-06-03 |
| 139 |
Composites Part BStrain rate dependent mechanical behavior of glass fiber reinforced polypropylene composites and its effect on the performance of automotive bumper beam structureDo-Hyoung Kim, So-Young Kang, Hee-June Kim and Hak-sung Kim |
166 | 483-496 | 2019-06-01 |
| 138 |
Composite StructuresComplex structured polymer concrete sleeper for rolling noise reduction of high-speed train systemSangKeun Ahn, SeMin Kwon, Yeon-Taek Hwang, Hyo-In Koh, Hak-Sung Kim, JunHong Park |
223 | 110944 | 2019-05-04 |