MCDM LAB
MCDM LAB
ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 87 |
Packaging and Manufacturing TechnologyAnalysis of Interfacial Peeling of an Ultrathin Silicon Wafer Chip in a Pick-Up Process Using an Air Blowing MethodEun-Beom Jeon, Sung-Hyeon Park, Yun-Sik Yoo, and Hak-Sung Kim |
6(11) | 1696-1702 | 2016-11-01 |
| 86 |
RSC AdvancesNovel synthesis of an iron oxalate capped iron oxide nanomaterial: a unique soil conditioner and slow release eco-friendly source of iron sustenance in plantsPallabi Das, Kasturi Sarmah, Nazneen Hussain, Sanjay Pratihar, Subhasish Das, Pradip Bhattacharyya, Supriya A. Patil, Hak-Sung Kim, Mohammed Iqbal A. Khazi and Satya Sundar Bhattacharya |
6(105) | 103012-103025 | 2016-10-25 |
| 85 |
Applied Surface ScienceTwo-step flash light sintering of copper nanoparticle ink to remove substrate warpingChung-Hyeon Ryu, Sung-Jun Joo and Hak-Sung Kim* |
384 | 182-191 | 2016-10-23 |
| 84 |
IEEE Transactions on Components, Packaging and Manufacturing TechnologyWarpage Simulation of a Multilayer Printed Circuit Board and Microelectronic Package Using the Anisotropic Viscoelastic Shell Modeling Technique That Considers the Initial WarpageDo-Hyoung Kim, Sung-Jun Joo, Dong-Ok Kwak, and Hak-Sung Kim* |
6(11) | 1667-1676 | 2016-10-10 |
| 83 |
Scientific ReportsWelding of silver nanowire networks via flash white light and UV-C irradiation for highly conductive and reliable transparent electrodesWan-Ho Chung, Sang-Ho Kim and Hak-Sung Kim* |
6 | 32086 | 2016-08-24 |