ACHIEVEMENT
번호 | 제목 | 권(호) | 쪽 | 출판년도 |
---|---|---|---|---|
18 |
Microelectronics ReliabilityInvestigation of moisture induced failures of stacked-die packageHak Sung Kim, Ho Geon Song |
47 | 1673-1679 | 2007-01-01 |
17 |
Composite StructuresDevelopment of Heavy duty Hybrid Carbon-Phenolic Hemispherical BearingsDong Chang Park, Seung Min Lee, Byung Chul Kim, Hak Sung Kim and Dai Gil Lee |
73 | 88-98 | 2006-01-01 |
16 |
Journal of Adhesion Science and TechnologyAvoidance of fabricational thermal residual stress of co-cure bonded metal/composite hybrid structuresHak Sung Kim and Dai Gil Lee |
20(9) | 959-979 | 2006-01-01 |
15 |
Composite StructuresEffect of the smart cure cycle on the performance of the co-cured aluminum/composite hybrid shaftHak Sung Kim, Sang Wook Park, Hui Yun Hwang and Dai Gil Lee |
75 | 276-288 | 2006-01-01 |
14 |
Composite StructuresOptimum design of the co-cured double lap joint between aluminum and carbon epoxy compositeSang Wook Park, Hak Sung Kim and Dai Gil Lee |
75 | 289-297 | 2006-01-01 |