MCDM LAB
MCDM LAB
ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 23 |
Journal of the Microelectronics and Packaging SocietyDevelopment of Warpage Simulation Method according to Thermal Stress based on Equivalent Anisotropic Viscoelastic ModelHeon-Su Kim, Hak-Sung Kim |
29(3) | 43-48 | 2022-09-29 |
| 22 |
Journal of the Microelectronics and Packaging SocietyA Study on Effect of Pad Design on Assembly and Adhesion Reliability of Surface Mount Technology (SMT)Dong-Woon Park, Myeong-Hyeon Yu, Hak-Sung Kim |
29(3) | 31-35 | 2022-09-29 |
| 21 |
Composites ResearchStudy on the Split Hopkinson Pressure Bar Apparatus for Measuring High-strain Rate Tensile Properties of Plastic MaterialIn-Soo Han, Se-Min Lee, Gyu-Won Kim, Hak-Sung Kim |
35(1) | 196-200 | 2022-06-30 |
| 20 |
Journal of the Korean Society for Nondestructive TestingDetecting defects in a polymer tube using terahertz and deep learning techniqueSang-Il Kim, Dong-Woon Park, Heon-Su Kim and Hak-Sung Kim |
42(2) | 129-135 | 2022-04-27 |
| 19 |
Composites ResearchAnalysis of defect signals inside glass fiber reinforced polymer through deconvolution of terahertz waveHeon-Su Kim, Dong-Woon Park, Sang-Il Kim, Jong-min Lee and Hak-Sung Kim |
35(1) | 8-12 | 2022-02-28 |