ACHIEVEMENT
번호 | 제목 | 개최일 |
---|---|---|
358 |
2023 한국마이크로전자 및 패키징 학회 (KMEPS)극단파 광 조사 및 인 전자 방법을 이용한 IGZO 산화물 반도체 어닐링 및 Ag 전극의 소결 방법을 이용한 박막 트렌지스터Jong-Whi Park, Chang-Jin Moon, and Hak-Sung Kim |
2023.04 |
357 |
2023 한국마이크로전자 및 패키징 학회 (KMEPS)Study on mechanical behavior of epoxy molding compound according to curing conditions using Fiber Bragg grating sensor and dilectric sensorJeong-Hyeon Baek, Jong-Whi Park, Woong-Kyoo Yoo, Han-Sung Ryu, Gyung-Hwan Oh, and Hak-Sung Kim |
2023.04 |
356 |
2023 한국마이크로전자 및 패키징 학회 (KMEPS)Double-sided Warpage free Package StructureWoong-Kyoo Yoo, Jeong-Hyeon Baek, Jong-Whi Park, and Hak-Sung Kim |
2023.04 |
355 |
2023 한국마이크로전자 및 패키징 학회 (KMEPS)Prediction of semiconductor package behavior according to the curing process conditions of epoxy molding compoundHui-Jin Um, Young-Min Ju, Dae-Woong Lee, Sangyul Ha, and Hak-Sung Kim |
2023.04 |
354 |
IEEE Electron Devices Technology and Manufacturing(EDTM) Conference 2023Prediction of crack type and fatigue life of printed circuit board under thermal cycling with respect to solder compositionHeon-Su Kim, You-Gwon Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee and Hak-Sung Kim |
2023.03 |