MCDM LAB

Multifunctional Composite Design and Manufacturing Laboratory
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358

2023 한국마이크로전자 및 패키징 학회 (KMEPS)

극단파 광 조사 및 인 전자 방법을 이용한 IGZO 산화물 반도체 어닐링 및 Ag 전극의 소결 방법을 이용한 박막 트렌지스터

Jong-Whi Park, Chang-Jin Moon, and Hak-Sung Kim

2023.04
357

2023 한국마이크로전자 및 패키징 학회 (KMEPS)

Study on mechanical behavior of epoxy molding compound according to curing conditions using Fiber Bragg grating sensor and dilectric sensor

Jeong-Hyeon Baek, Jong-Whi Park, Woong-Kyoo Yoo, Han-Sung Ryu, Gyung-Hwan Oh, and Hak-Sung Kim

2023.04
356

2023 한국마이크로전자 및 패키징 학회 (KMEPS)

Double-sided Warpage free Package Structure

Woong-Kyoo Yoo, Jeong-Hyeon Baek, Jong-Whi Park, and Hak-Sung Kim

2023.04
355

2023 한국마이크로전자 및 패키징 학회 (KMEPS)

Prediction of semiconductor package behavior according to the curing process conditions of epoxy molding compound

Hui-Jin Um, Young-Min Ju, Dae-Woong Lee, Sangyul Ha, and Hak-Sung Kim

2023.04
354

IEEE Electron Devices Technology and Manufacturing(EDTM) Conference 2023

Prediction of crack type and fatigue life of printed circuit board under thermal cycling with respect to solder composition

Heon-Su Kim, You-Gwon Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee and Hak-Sung Kim

2023.03