ACHIEVEMENT
번호 | 제목 | 개최일 |
---|---|---|
378 |
The 21st International Symposium on Microelectronics and Packaging [ISMP 2023]Study on the Photonic Sintering Process of BaTiO3 Nanoparticles with Added Graphene for the Implementation of Dielectric ConstanSeok-Hoon Jeong , Jong-Whi Park, and Hak-Sung Kim |
2023.10 |
377 |
The 21st International Symposium on Microelectronics and Packaging [ISMP 2023]Deep learning - based terahertz inspection technique for internal defect detection in ceramic, polymer, and metal composites used in semiconductor manufacturing process.Tae-Wan Kim, Sang-Il Kim, You-Gwon Kim, Heon-Su Kim, and Hak-Sung Kim |
2023.10 |
376 |
The 21st International Symposium on Microelectronics and Packaging [ISMP 2023]Effect of Solder Composition on Fatigue Life in Repeated Thermal Cycling of Printed Circuit BoardsYou-Gwon Kim, Heon-Su Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
2023.10 |
375 |
2023 한국군사과학기술학회에너지 저장 샌드위치 구조에 대한 다기능 성능 분석엄희진, 전나현, 한영구, 신지환, 김학성 |
2023.06 |
374 |
2023 한국군사과학기술학회병렬형 컨벌루션 학습을 통한 3D 공간의 온도 분포 예측에 대한 연구전나현, 박종휘, 정석훈, 신지환, 김학성 |
2023.06 |