ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 421 |
ISMP-IRSR 2024In-situ non-destructive inspection technique for analyzing chip alignment and warpage in semiconductor packages using terahertz wavesSang-Il Kim, Heon-Su Kim and Hak-Sung Kim |
2024.11 |
| 420 |
ISMP-IRSR 2024Enhancing adhesion of Ti/Cu seed layers on ABF substrate through plasma treatment and seed layer thickness variationSe-Min Lee, Hui-Jin Um, Na-Hyun Jeon, Hyun-Ji Rho, Soon-Oh Jeong, Young-Ju Han , Moo-Seong Kim and Hak-Sung Kim |
2024.11 |
| 419 |
ISMP-IRSR 2024Automatic Pattern Classification-based Prediction of Warpage in Complex Patterned Semiconductor Packages Considering The Anisotropic Viscoelastic PropertiesWoong-Kyoo Yoo, Jeong-Hyeon Baek, and Hak−Sung Kim |
2024.11 |
| 418 |
ISMP-IRSR 2024Study on warpage reduction of RDL interposer packages through optimization of electroplating current densityTaek−Hyeon Kim, Sang−Il Kim, Tae Hoon Kim, Ji-Hye Shim and Hak−Sung Kim |
2024.11 |
| 417 |
ISMP-IRSR 2024Experimental And Simulation Results For Accurate Warpage Prediction of Semiconductor PackageHak-Sung Kim |
2024.11 |