ACHIEVEMENT
번호 | 제목 | 개최일 |
---|---|---|
380 |
Korean International Semiconductor Conference On Manufacturing Technology 2023 [KISM 2023]Study on the mechanical behavior of epoxy molding compound under various curing conditions using fiber Bragg grating sensor and dielectric sensorJeong-Hyeon Baek, Jong-Whi Park, Woong-Kyoo Yoo and Hak-Sung Kim |
2023.11 |
379 |
Korean International Semiconductor Conference On Manufacturing Technology 2023 [KISM 2023]Silver Nanowire Bottom Gate Electrodes fabricated by Intense Pulsed Light Welding and Mechanical Roll-Pressing for Thin Film Transistor FabricationYoung-Min Ju, Jong-Whi Park, and Hak-Sung Kim |
2023.11 |
378 |
The 21st International Symposium on Microelectronics and Packaging [ISMP 2023]Study on the Photonic Sintering Process of BaTiO3 Nanoparticles with Added Graphene for the Implementation of Dielectric ConstanSeok-Hoon Jeong , Jong-Whi Park, and Hak-Sung Kim |
2023.10 |
377 |
The 21st International Symposium on Microelectronics and Packaging [ISMP 2023]Deep learning - based terahertz inspection technique for internal defect detection in ceramic, polymer, and metal composites used in semiconductor manufacturing process.Tae-Wan Kim, Sang-Il Kim, You-Gwon Kim, Heon-Su Kim, and Hak-Sung Kim |
2023.10 |
376 |
The 21st International Symposium on Microelectronics and Packaging [ISMP 2023]Effect of Solder Composition on Fatigue Life in Repeated Thermal Cycling of Printed Circuit BoardsYou-Gwon Kim, Heon-Su Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
2023.10 |