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416

2024 한국비파괴검사학회 추계학술대회

In-situ inspection technique for chip alignment and warpage in semiconductor package using terahertz waves

Sang-Il Kim, Heon-Su Kim, Hak-Sung Kim

2024.11
415

2024 한국비파괴검사학회 추계학술대회

Real-time inspection of polymer thermal degradation using terahertz waves

Tae-Wan Kim, Sang-Il Kim, Heon-Su Kim, Hak-Sung Kim

2024.11
414

2024 ECCM 국제 학술 대회

Multifunctional composites structure design with an integrated system for battery management and bubble generation control

Hyun-Ji Rho, Hui-Jin Um, Na-Hyun Jeon, Hak-Sung Kim

2024.07
413

2024 ECCM 국제 학술 대회

Prediction of Mechanical Behavior of Carbon Fiber Braided Composites: A Multi-Scale Simulation-Based Progressive Failure Model

Jeong-Hyeon Baek, Se-Min Lee, Hak-Sung Kim

2024.07
412

2024 ECCM 국제 학술 대회

Study on buckling behavior of composite sandwich structure with 3D printed corrugated core under hydrostatic pressure

Na-Hyun Jeon, Hui-Jin Um, Hak-Sung Kim

2024.07