ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 406 |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)Measurement of the Interfacial Strength of Thin Film by Laser Spallation Method for Advanced Wafer Level Package주영민, 엄희진, 이세민, 김덕용, 유웅규, 이대웅, 황연택, 이승환, 김학성 |
2024.05 |
| 405 |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)Derivation of Representative Creep Properties for Accurate Thermal Fatigue Life Prediction in SAC305 Solder Joints through Grain and Microstructure Control주영민, 김유권, 류성웅, 김학성 |
2024.05 |
| 404 |
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)Advanced Bonding Process based on Intense Pulsed Light Irradiation for Solder Bump in Flip-Chip Package류성웅, 박종휘, 주영민, 김학성 |
2024.05 |
| 403 |
2024 WCNDT 비파괴 국제 학술 대회Non-destructive evaluation of polymer pipe degradation using terahertz inspection techniquesTae-Wan Kim, Sang-Il Kim, Heon-Su Kim, Hak-Sung Kim |
2024.05 |
| 402 |
2024 WCNDT 비파괴 국제 학술 대회Porosity Assessment of Battery Separators Using Terahertz TechnologyHeon-Su Kim, Sang-Il Kim, Hak-Sung Kim |
2024.05 |