MCDM LAB

Multifunctional Composite Design and Manufacturing Laboratory
번호 제목 권(호) 출판년도
206

Journal of the Microelectronics and Packaging Society

Measurement of effective cure shrinkage of EMC using dielectric sensor and FBG sensor

Jeong-hyeon Baek, Dong-woon Park and Hak-sung Kim

29(4) 83-87 2022-12-30
205

Mechanical Systems and Signal Processing

Metal forming defect detection method based on recurrence quantification analysis of time-series load signal measured by real-time monitoring system with bolt-type piezoelectric sensor

In-Je Jang, Gi-Hyun Bae, and Hak-Sung Kim

180 109457 2022-11-15
204

Structural Health Monitoring

Machine-Learning Based Damage sensing and Self-Healing of Carbon Fiber/Nylon Composites via Addressable Conducting Networks

Myeong-Hyeon Yu, Ji-Seok Lee, Hak-Sung Kim

22(5) 3401-3415 2022-11-02
203

International Journal of Precision Engineering and Manufacturing-Green Technology

Influence of Pad Design on Assembly Reliability of Surface Mounted Devices

Dong-Woon Park, Myeong-Hyeon Yu, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim

10 1235-1248 2022-10-27
202

Thin Solid Films

Non-vacuum room temperature-processed pattering of molybdenum pattern by intense pulsed light irradiation for reliable electronic devices

Chan-Jin Moon, Jong-Whi Park, Yong-Rae Jang, Young-Min Ju, Hak-sung Kim

759 139468 2022-10-01