번호 제목 권(호) 출판년도
211

Materials & Designs

Prediction of fatigue life of semiconductor package under thermal cycling: combined effect of package design and solder materials

Heon-Su Kim, You-Gwon Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim

254 Article 114059 2025-05-06
210

Materials and Design

Microstructural analysis and design of electroplated-Cu micropillar under different process variables and pattern structures

Sang-Yeun Park, Byung-Kwon Chun, Sun-Bum Kim, Hak-Sung Kim, Hong-Yun So

252 113715 2025-02-11
209

Composites Part B

Mechanical performance of novel curved sandwich structures featuring 3D printed continuous carbon fiber/polyamide 6 composite corrugated core with railway interlocking

Hui-Jin Um, Hyun-Ji Rho, Na-Hyun Jeon, Ji-Hwan Shin and Hak-Sung Kim

295 112222 2025-01-31
208

Energy Conversion and Management: X

Enhancing cold storage efficiency: Continuous deep deterministic policy gradient approach to energy optimization utilizing strategic sensor input data

Jong-Whi Park, Young-Min Ju, and Hak-Sung Kim

26 100901 2025-01-25
207

International Journal of Precision Engineering and Manufacturing-Green Technology

Multi-scale (Macro-Meso-Micro) Progressive Failure Simulation of the Carbon Fiber Braided Structure Under Quasi-static Mechanical Loading

Se-Min Lee, Jeong-Hyeon Baek, Myeong-Hyeon Yu, Seong-Wook Jeon, Woo-Seok Choi, Sung-Pil Heo, Moon-Ho Yang, Jun-Hong Park and Hak-Sung Kim

12 2024-12-27