ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 190 |
Engineering Fracture MechanicsMixed mode fracture toughness of epoxy molding compound/printed circuit board interface of semiconductor packages with respect to temperature and moistureHui-Jin Um, Se-Min Lee, Dae-Woong Lee, Sangyul Ha, and Hak-Sung Kim |
289 | 09429 | 2023-09-01 |
| 189 |
Composite StructuresPrediction of stress-strain behavior of carbon fabric woven composites by deep neural networkDug-Joong Kim, Gyu-Won Kim, Jeong-hyeon Baek, Byeunggun Nam, Hak-Sung Kim |
318 | 117073 | 2023-08-15 |
| 188 |
Composites Part AMulti-scale progressive failure analysis of shear deformed woven fabric composites considering its pre-forming processYeon-Taek Hwang, Hui-Jin Um, Hak-Sung Kim |
174 | 2023-07-30 | |
| 187 |
Polymer TestingIn-situ non-contact monitoring algorithm for PET crystallinity and moisture content using Terahertz time-domain spectroscopySang-Il kim, Dong-Woon Park, Heon-Su Kim, and Hak-sung Kim |
124 | 108085 | 2023-07-01 |
| 186 |
Journal of Infrared, Millimeter, and Terahertz WavesIn-situ thickness measurement of thin deposited layer on the silicon wafer using multi-reflected terahertz electro-magnetic waveDong-Woon Park, Gyung-Hwan Oh, Heon-Su Kim, Jindoo Choi, Fabio Righetti, Jin-Sung Kang, and Hak-Sung Kim |
44 | 458-472 | 2023-06-05 |