MCDM LAB
MCDM LAB
ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 350 |
한국군사과학기술학회 추계학술대회탄소섬유와 유리섬유가 혼합된 일방향 하이브리드 복합재료의 굽힘 특성과 에너지 흡수도에 대한 패턴 설계 연구전나현, 엄희진, 김학성 |
2022.11 |
| 349 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Life-prediction of Ag sintered die attach interconnects for SiC power module semiconductorYong-Rae Jang, Tae-Hwa Kim, Bongtae Han, and Hak-Sung Kim |
2022.11 |
| 348 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Improvement of assembly reliability by optimization of pad design on printed circuit boardDong-woon Park, Hak-Sung Kim |
2022.11 |
| 347 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Study on the mixed-mode delamination of epoxy mold compound(EMC)/printed circuit board(PCB) interface considering various temperature and moisture absorptionHui-Jin Um, Se-Min Lee, Dae-Woong Lee, Sangyul Ha, and Hak-Sung Kim |
2022.11 |
| 346 |
International Symposium on Microelectronics and Packaging (ISMP 2022)Prediction of Solder Fatigue Life of Package by Automated Parametric Modeling Simulation TechniqueHeon-Su Kim, You-Gwon Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
2022.11 |