ACHIEVEMENT
| 번호 | 제목 | 개최일 |
|---|---|---|
| 418 |
ISMP-IRSR 2024Study on warpage reduction of RDL interposer packages through optimization of electroplating current densityTaek−Hyeon Kim, Sang−Il Kim, Tae Hoon Kim, Ji-Hye Shim and Hak−Sung Kim |
2024.11 |
| 417 |
ISMP-IRSR 2024Experimental And Simulation Results For Accurate Warpage Prediction of Semiconductor PackageHak-Sung Kim |
2024.11 |
| 416 |
2024 한국비파괴검사학회 추계학술대회In-situ inspection technique for chip alignment and warpage in semiconductor package using terahertz wavesSang-Il Kim, Heon-Su Kim, Hak-Sung Kim |
2024.11 |
| 415 |
2024 한국비파괴검사학회 추계학술대회Real-time inspection of polymer thermal degradation using terahertz wavesTae-Wan Kim, Sang-Il Kim, Heon-Su Kim, Hak-Sung Kim |
2024.11 |
| 414 |
2024 ECCM 국제 학술 대회Multifunctional composites structure design with an integrated system for battery management and bubble generation controlHyun-Ji Rho, Hui-Jin Um, Na-Hyun Jeon, Hak-Sung Kim |
2024.07 |