ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 208 |
Journal of the Microelectronics and Packaging SocietyMeasurement of effective cure shrinkage of EMC using dielectric sensor and FBG sensorJeong-hyeon Baek, Dong-woon Park and Hak-sung Kim |
29(4) | 83-87 | 2022-12-30 |
| 207 |
Mechanical Systems and Signal ProcessingMetal forming defect detection method based on recurrence quantification analysis of time-series load signal measured by real-time monitoring system with bolt-type piezoelectric sensorIn-Je Jang, Gi-Hyun Bae, and Hak-Sung Kim |
180 | 109457 | 2022-11-15 |
| 206 |
Structural Health MonitoringMachine-Learning Based Damage sensing and Self-Healing of Carbon Fiber/Nylon Composites via Addressable Conducting NetworksMyeong-Hyeon Yu, Ji-Seok Lee, Hak-Sung Kim |
22(5) | 3401-3415 | 2022-11-02 |
| 205 |
International Journal of Precision Engineering and Manufacturing-Green TechnologyInfluence of Pad Design on Assembly Reliability of Surface Mounted DevicesDong-Woon Park, Myeong-Hyeon Yu, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
10 | 1235-1248 | 2022-10-27 |
| 204 |
Thin Solid FilmsNon-vacuum room temperature-processed pattering of molybdenum pattern by intense pulsed light irradiation for reliable electronic devicesChan-Jin Moon, Jong-Whi Park, Yong-Rae Jang, Young-Min Ju, Hak-sung Kim |
759 | 139468 | 2022-10-01 |