MCDM LAB
MCDM LAB
ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 231 |
Optics & Laser TechnologyElectron density measurement of Ar, N2, O2, and Ar mixtures (with N2 and O2) gas in inductively coupled plasma (ICP) using terahertz time domain spectroscopySang-il Kim, Dong-Woon Park, Heon-Su Kim, and Hak-Sung Kim |
180 | 111540 | 2025-01-01 |
| 230 |
International Journal of Precision Engineering and Manufacturing-Green TechnologyPrediction of the mechanical properties for carbon fiber braided pipe via a progressive failure model based on multi-scale simulationSe-Min Lee, Jeong-Hyeon Baek, Myeong-Hyeon Yu, Seong-Wook Jeon, Woo-Seok Choi, Sung-Pil Heo, Moon-Ho Yang, Jun-Hong Park and Hak-Sung Kim |
(Accepted) | 2025-00-00 | |
| 229 |
Journal of Infrared, Millimeter, and Terahertz WavesDetection of Hidden Defects inside Polymer Tubes Using Anomaly Detection with Generative Adversarial Neural Network Based on Terahertz Scanning ImagesHeon-Su Kim, Sang-Il Kim, You-Gwon Kim, Dong-Woon Park, and Hak-Sung Kim |
46(4) | 2024-12-23 | |
| 228 |
Chemical Engineering JournalIntense Pulsed Light-Induced Millisecond Selective Heat Treatment for High-Performance Silicon AnodesChangyong Park, Sucheol Kim, Hojae Lee, Jong-Whi Park, Minwoo Choi, Kwanghyun Do, Chiho Song, Hak-Sung Kim, Young-Beom Kim, Junki Rhee, Neetu Bansal, Rahul R. Salunkhe, Heejoon Ahn |
498 | 155312 | 2024-10-15 |
| 227 |
Materials and DesignReduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compoundHui-Jin Um, Young-Min Ju, Dae-Woong Lee, Jinho Ahn, and Hak-Sung Kim |
245 | 113265 | 2024-09-15 |