번호 제목 권(호) 출판년도
237

ACS Applied Materials & Interfaces

Ultra milli-second flip-chip bonding process via intense pulsed light irradiation

Young-Min Ju, Seong-Ung Ryu, Jong-Whi Park, and Hak-Sung Kim

17 (27) 39694–39707 2025-06-09
236

Materials & Design

Prediction of fatigue life of semiconductor package under thermal cycling: combined effect of package design and solder materials

Heon-Su Kim, You-Gwon Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim

103 796-808 2025-05-06
235

Composites Part B

Mechanical performance of novel curved sandwich structures featuring 3D printed continuous carbon fiber/polyamide 6 composite corrugated core with railway interlocking

Hui-Jin Um, Hyun-Ji Rho, Na-Hyun Jeon, Ji-Hwan Shin and Hak-Sung Kim

295 112222 2025-04-15
234

Energy Conversion and Management: X

Enhancing Cold Storage Efficiency: Continuous DDPG Approach for Energy Consumption Minimization Utilizing Strategic Sensor Input Data

Jong-Whi Park, Young-Min Ju, and Hak-Sung Kim

26 100901 2025-04-15
233

Materials and Design

Microstructural analysis and design of electroplated-Cu micropillar under different process variables and pattern structures

Sang-Yeun Park, Byung-Kwon Chun, Sun-Bum Kim, Hak-Sung Kim, Hong-Yun So

252 113715 2025-04