ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 238 |
Materials & DesignPrediction of fatigue life of semiconductor package under thermal cycling: combined effect of package design and solder materialsHeon-Su Kim, You-Gwon Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
103 | 796-808 | 2025-05-06 |
| 237 |
Composites Part BMechanical performance of novel curved sandwich structures featuring 3D printed continuous carbon fiber/polyamide 6 composite corrugated core with railway interlockingHui-Jin Um, Hyun-Ji Rho, Na-Hyun Jeon, Ji-Hwan Shin and Hak-Sung Kim |
295 | 112222 | 2025-04-15 |
| 236 |
Energy Conversion and Management: XEnhancing Cold Storage Efficiency: Continuous DDPG Approach for Energy Consumption Minimization Utilizing Strategic Sensor Input DataJong-Whi Park, Young-Min Ju, and Hak-Sung Kim |
26 | 100901 | 2025-04-15 |
| 235 |
Materials and DesignMicrostructural analysis and design of electroplated-Cu micropillar under different process variables and pattern structuresSang-Yeun Park, Byung-Kwon Chun, Sun-Bum Kim, Hak-Sung Kim, Hong-Yun So |
252 | 113715 | 2025-04 |
| 234 |
Optics & Laser TechnologyElectron density measurement of Ar, N2, O2, and Ar mixtures (with N2 and O2) gas in inductively coupled plasma (ICP) using terahertz time domain spectroscopySang-il Kim, Dong-Woon Park, Heon-Su Kim, and Hak-Sung Kim |
180 | 111540 | 2025-01-01 |