ACHIEVEMENT
번호 | 제목 | 권(호) | 쪽 | 출판년도 |
---|---|---|---|---|
229 |
Materials and DesignReduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compoundHui-Jin Um, Young-Min Ju, Dae-Woong Lee, Jinho Ahn, and Hak-Sung Kim |
245 | 113265 | 2024-09-15 |
228 |
Composites ResearchStrain Rate and Temperature Effects on TPO and PP for Enhanced Airbag Deployment SimulationSe-Min Lee, Gyu-Won Kim,Jae-Hyun Ahn, In-Soo Han, Hak-Sung Kim |
37 | 325-329 | 2024-08-31 |
227 |
Journal of Rail and Rapid TransitReal-scale experiments of resistive heating laminate composite panels for radiant heating in railway vehiclesJuyeop Park,Donghoon Kang,Bonyoung Koo, Min-Ki Cho, and Hak-Sung Kim |
238 | 1328-1337 | 2024-08-16 |
226 |
Optics & Laser TechnologyElectron density measurement of Ar, N2, O2, and Ar mixtures (with N2 and O2) gas in inductively coupled plasma (ICP) using terahertz time domain spectroscopySang-Il Kim, Dong-Woon Park, Heon-Su Kim, Hak-Sung Kim |
180 | 2024-06-30 | |
225 |
비파괴검사학회지딥러닝과 테라헤르츠 기술을 이용한 세라믹-폴리머-금속 복합체 내부 결함 검사에 관한 연구You-Gwon Kim, Sang-Il Kim, Heon-Su Kim, Hak-Sung Kim |
44(3) | 172-179 | 2024-06-14 |