ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 243 |
ACS Applied Materials & InterfacesUltra milli-second flip-chip bonding process via intense pulsed light irradiationYoung-Min Ju, Seong-Ung Ryu, Jong-Whi Park, and Hak-Sung Kim |
17 (27) | 39694–39707 | 2025-06-09 |
| 242 |
Applied Surface Science AdvancesMeasurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation testYoung-Min Ju, Dukyong Kim, Se-Min Lee, Heuisu Kim, Daewoong Lee, Yeontaek Hwang, Seung Hwan Lee and Hak-Sung Kim |
28 | 100783 | 2025-06-07 |
| 241 |
Composites Part B: EngineeringEffect of Geometric Configurations and Heat Treatment on the Tensile Properties, Joint Performance, and Failure Behavior of 3D-Printed Carbon and Glass Fiber CompositesSanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song, and Hak-Sung Kim |
304 | 112693 | 2025-06-03 |
| 240 |
Materials & DesignsPrediction of fatigue life of semiconductor package under thermal cycling: combined effect of package design and solder materialsHeon-Su Kim, You-Gwon Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
254 | Article 114059 | 2025-05-06 |
| 239 |
Materials and DesignMicrostructural analysis and design of electroplated-Cu micropillar under different process variables and pattern structuresSang-Yeun Park, Byung-Kwon Chun, Sun-Bum Kim, Hak-Sung Kim, Hong-Yun So |
252 | 113715 | 2025-02-11 |