ACHIEVEMENT
번호 | 제목 | 권(호) | 쪽 | 출판년도 |
---|---|---|---|---|
216 |
Scientific ReportsAll printed thin film transistor with solution-based Indium-Gallium-Zinc-Oxide semiconductor and printed Ag electrodes via intense pulsed light annealing.Chang-Jin Moon, Jong-Whi Park, Yong-Rae Jang and Hak-Sung Kim |
14 | 1566 | 2024-01-18 |
215 |
Applied Energy50% Reduction in Energy Consumption in an Actual Cold Storage Facility Using a Deep Reinforcement Learning-based Control AlgorithmJong-Whi Park, Young-Min Ju, You-Gwon Kim, and Hak-Sung Kim |
352 | 121996 | 2023-12-15 |
214 |
Composites Part AMulti-scale progressive failure analysis of shear deformed woven fabric composites considering its pre-forming processYeon-Taek Hwang, Hui-Jin Um and Hak-Sung Kim |
174 | 107713 | 2023-11 |
213 |
Advanced Composites and Hybrid MaterialsHigh-performance multifunctional energy-storage corrugated lattice core sandwich structure via continuous carbon fiber (CCF)/Polyamide 6 (PA6) 3D printingHui-Jin Um, Na-Hyun Jeon, Ji-Hwan Shin and Hak-Sung Kim |
Published online | 1-18 | 2023-10-03 |
212 |
Engineering Fracture MechanicsMixed mode fracture toughness of epoxy molding compound/printed circuit board interface of semiconductor packages with respect to temperature and moistureHui-Jin Um, Se-Min Lee, Dae-Woong Lee, Sangyul Ha, and Hak-Sung Kim |
289 | 09429 | 2023-09-01 |