ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 213 |
Journal of Infrared, Millimeter, and Terahertz WavesIn-situ thickness measurement of thin deposited layer on the silicon wafer using multi-reflected terahertz electro-magnetic waveDong-Woon Park, Gyung-Hwan Oh, Heon-Su Kim, Jindoo Choi, Fabio Righetti, Jin-Sung Kang, and Hak-Sung Kim |
44 | 458-472 | 2023-06-05 |
| 212 |
Composites Part : BNon-destructive detection of thin micro-defects in glass reinforced polymer composites using a terahertz electro–magnetic wave based on a convolution neural networkHeon-Su Kim a, Dong-Woon Park a, Sang-Il Kim a, Gyung-Hwan Oh a, Hak-Sung Kim |
257 | 110694 | 2023-05-15 |
| 211 |
International Journal of Precision Engineering and Manufacturing-Green TechnologyCorrosion Lifetime Estimation of Printed Circuit Board in Marine Atmosphere Environment Using Multiphysics SimulationSang‑Il Kim, Dug‑Joong Kim, Do‑Hyung Kim, Dong‑Min Jang, Jin‑Woo Jang, Seung‑Yeong Lee, Hak‑Sung Kim |
10 | 789–805 | 2023-05 |
| 210 |
Journal of the Microelectronics and Packaging SocietySolder Alloy Types and Solder Joint Reliability Evaluation TechniquesYou-Gwon Kim, Heon-Su Kim, Tae-Wan Kim, Hak-Sung Kim |
30(1) | 17-29 | 2023-03-30 |
| 209 |
International Journal of Precision Engineering and Manufacturing-Green TechnologyIntense pulsed light welding process with mechanical roll-pressing for highly conductive silver nanowire transparent electrodeYoung-Min Ju, Jong-Whi Park, Yong-Rae Jang, Simon. S. Park, and Hak-Sung Kim |
11 | 203-219 | 2023-01-05 |