ACHIEVEMENT
번호 | 제목 | 권(호) | 쪽 | 출판년도 |
---|---|---|---|---|
217 |
Advanced Composites and Hybrid MaterialsA Critical Review of the Past, Present, and Future of 3D Printing for Continuous and Short Fiber CompositesSanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
216 |
Composites Part B: EngineeringEffect of Geometric Configurations and Heat Treatment on the Tensile Properties, Joint Performance, and Failure Behavior of 3D-Printed Carbon and Glass Fiber CompositesSanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
215 |
ACS Applied Materials & InterfacesUltra milli-second flip-chip bonding process via intense pulsed light irradiationYoung-Min Ju, Seong-Ung Ryu, Jong-Whi Park, and Hak-Sung Kim |
(Aceepted) | 9999-99-99 | |
214 |
Journal of Alloys and CompoundsSynergistic Role of Bi, Ni, and Pd Alloying in SAC305 for Enhanced IMC Suppression and Superior Thermo-Mechanical PerformanceYou-Gwon Kim, Heon-Su Kim, Tae Wan Kim, Hyeong-Bin Park, Jong-Whi Park, Yongrae Jang, Bongtae Han, Jun-Hyeong Lee, Jin Gyu Kim, Hak-Sung Kim |
(Submitted) | 9999-99-99 | |
213 |
NDT & E InternationalIn-situ non-contact monitoring of photoresist thickness and degree of cure using terahertz time-domain spectroscopySang-Il Kim and Hak-Sung Kim |
(Submitted) | 9999-99-99 |