ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 214 |
Composites Part B: EngineeringEffect of Geometric Configurations and Heat Treatment on the Tensile Properties, Joint Performance, and Failure Behavior of 3D-Printed Carbon and Glass Fiber CompositesSanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song, and Hak-Sung Kim |
304 | 112693 | 2025-09 |
| 213 |
Applied Surface Science AdvancesMeasurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation testYoung-Min Ju, Dukyong Kim, Se-Min Lee, Heuisu Kim, Daewoong Lee, Yeontaek Hwang, Seung Hwan Lee and Hak-Sung Kim |
28 | 100783 | 2025-08-01 |
| 212 |
ADVANCED MATERIALS TECHNOLOGIESAdvanced Optical Integration Processes for Photonic-Integrated Circuit PackagingKeuntae Baek, Minhyeok Kim, Hak-Sung Kim, Jinho Ahn, and Hongyun So |
e01848 (1–30) | 2025-06-25 | |
| 211 |
Transactions on Components, Packaging and Manufacturing TechnologyDetermination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder JointYongrae Jang, You-Gwon Kim, Hak-Sung Kim, Do-Hyung Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Bongtae Han |
2025-06-13 | ||
| 210 |
ACS Applied Materials & InterfacesUltra milli-second flip-chip bonding process via intense pulsed light irradiationYoung-Min Ju, Seong-Ung Ryu, Jong-Whi Park, and Hak-Sung Kim |
2025-06-09 |