ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 208 |
ACS Applied Materials & InterfacesUltra milli-second flip-chip bonding process via intense pulsed light irradiationYoung-Min Ju, Seong-Ung Ryu, Jong-Whi Park, and Hak-Sung Kim |
17 (27) | 39694–39707 | 2025-06-09 |
| 207 |
Materials & DesignPrediction of fatigue life of semiconductor package under thermal cycling: combined effect of package design and solder materialsHeon-Su Kim, You-Gwon Kim, Dong-Min Jang, Jin-Woo Jang, Seung-Yeong Lee, and Hak-Sung Kim |
103 | 796-808 | 2025-05-06 |
| 206 |
Composites Part BMechanical performance of novel curved sandwich structures featuring 3D printed continuous carbon fiber/polyamide 6 composite corrugated core with railway interlockingHui-Jin Um, Hyun-Ji Rho, Na-Hyun Jeon, Ji-Hwan Shin and Hak-Sung Kim |
295 | 112222 | 2025-04-15 |
| 205 |
Energy Conversion and Management: XEnhancing Cold Storage Efficiency: Continuous DDPG Approach for Energy Consumption Minimization Utilizing Strategic Sensor Input DataJong-Whi Park, Young-Min Ju, and Hak-Sung Kim |
26 | 100901 | 2025-04-15 |
| 204 |
Materials and DesignMicrostructural analysis and design of electroplated-Cu micropillar under different process variables and pattern structuresSang-Yeun Park, Byung-Kwon Chun, Sun-Bum Kim, Hak-Sung Kim, Hong-Yun So |
252 | 113715 | 2025-04 |