번호 제목 권(호) 출판년도
225

Measurement

In-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electromagnetic waves

Sang-Il Kim, Heon-Su Kim, Tae-Wan Kim, Jinsang Lim, Dong-Su Han, Hae Gu Lee, and Hak-Sung Kim

262 120035 2025.12.09
224

Construction and Building Materials

Optimization and field evaluation of a detachable thermal insulation fabric for rail temperature mitigation

Juyeop Park, Donghoon Kang, Hak-Sung Kim

500 2025.10.22
223

Composite Structures

A Critical Review of the Past, Present, and Future of 3D Printing for Continuous and Short Fiber Composites

Sanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song, and Hak-Sung Kim

376 119819 2025-11-07
222

Materials & Design

Effect of electroplating current density and post-annealing on the warpage and reliability of redistributed layer for advanced semiconductor package

Taek-Hyeon Kim, Jeong-Hyeon Baek, Sang-Il Kim, Tae-Hoon Kim, Ji-Hye Shim and Hak-Sung Kim

259 114732 2025-09-16
221

Materials & Design

Integrated Design and Validation of 3D Radiant Heater for Electric Vehicles: Thermo-Electrical Finite Element Analysis Considering Strain-Dependent Resistance in Thermo-Forming

Jeong-Hyeon Baek, Tae-In Park, Yoon-Jin Kim, Ji-Sun Park and Hak-Sung Kim

258 114701 2025-09-05