ACHIEVEMENT
| 번호 | 제목 | 권(호) | 쪽 | 출판년도 |
|---|---|---|---|---|
| 218 |
Archive of Compututational Methods in EngineeringFast warpage prediction of printed circuit board with the automatically classified copper patterns for anisotropic viscoelastic homogenizationWoong-Kyoo Yoo,Jeong-Hyeon Baek,Jong-Whi Park,Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 217 |
NDT & E InternationalIn-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electro-magnetic waveHeon-Su Kim, Sang-Il Kim, Tae-Wan Kim, Jin-Sang Lim, Dong-Su Han, Hae-Gu Lee, and Hak-Sung Kim |
(Sumitted) | 9999.99.99 | |
| 216 |
Composite Part BA Critical Review of the Past, Present, and Future of 3D Printing for Continuous and Short Fiber CompositesSanjay Kumar, Dong-Hoon Yoo, Jun-Seop Song, and Hak-Sung Kim |
(Submitted) | 9999.99.99 | |
| 215 |
NDT & E InternationalIn-situ non-contact monitoring of photoresist thickness and degree of cure using terahertz time-domain spectroscopySang-Il Kim and Hak-Sung Kim |
(Submitted) | 9999-99-99 | |
| 214 |
Composites Part BDevelopment of the modified V-notched rail shear test for carbon fiber reinforced composites with multi-scale simulation method considering microscopic failure pointsGyu-Won Kim, Hyun-Ji Rho, Young-Wu Kim, Jun-Seop Song, Woe-Tae Kim, Dong-Hwi Kim, Jong-Whi Park, and Hak-Sung Kim |
(Submitted) | 9999-99-99 |